08/30/2024, 01:15 PM UTC
先进封装技术扩展其影响力Advanced Packaging expands its footprint
➀ 先进封装设备销售额预计在2024年增长超过10%，并可能在2025年超过20%。➁ AI服务器的需求推动了InFO、CoWoS和SoIC等先进封装技术的发展。➂ 主要公司正在全球范围内扩大其先进封装产能，包括TSMC、Intel、Samsung、SK hynix和Micron等新建的设施。➀ Sales of advanced packaging equipment are projected to increase by over 10% in 2024 and potentially exceed 20% in 2025. ➁ The demand for AI servers is driving the development of advanced packaging technologies like InFO, CoWoS, and SoIC. ➂ Major companies are expanding their advanced packaging capacities globally, with new facilities being established by TSMC, Intel, Samsung, SK hynix, and Micron.
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