➀ Sales of advanced packaging equipment are projected to increase by over 10% in 2024 and potentially exceed 20% in 2025. ➁ The demand for AI servers is driving the development of advanced packaging technologies like InFO, CoWoS, and SoIC. ➂ Major companies are expanding their advanced packaging capacities globally, with new facilities being established by TSMC, Intel, Samsung, SK hynix, and Micron.