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October 22
- Guangdong Issues Action Plan to Accelerate the Innovation and Development of Optical Chip Industry (2024-2030)
芯榜
➀ Guangdong Province has issued an action plan to accelerate the innovation and development of the optical chip industry (2024-2030);
➁ The plan aims to achieve breakthroughs in 10 or more key core technologies in the optical chip field by 2030;
➂ It focuses on fostering international competitive leading enterprises, constructing national and provincial innovation platforms, and forming a new billion-level industrial cluster.
- Nordic Semiconductor Giant Acquires a Chip Manufacturer!
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➀ Norwegian wireless chip supplier Nordic has agreed to acquire Norwegian peer UWB (ultra-wideband) chip company Novelda.
➁ The acquisition amount has not been disclosed, and the transaction is subject to satisfactory due diligence, final board approval, and certain other conditions.
➂ Nordic, founded in 1983, is a leading integrated circuit hardware and software supplier, focusing on the research, design, and sales of wireless IoT system-on-chip and has been a pioneer in ultra-low-power wireless technology.
- Microsoft: What are the Challenges for the Next Step of AI Computing Power Expansion?
Microsoft
➀ Microsoft's Zaid Kahn, the vice president of Cloud AI and Advanced Systems, discussed the challenges faced when expanding AI clusters to tens of thousands of accelerators and larger scales at the AI Hardware Summit.
➁ He believes that the next generation of systems requires new system architectures, vertical power transmission, interconnect innovations, and new advanced cooling technologies.
➃ Microsoft has increased its supercomputing capabilities by over 30 times in the past six months.
- Qualcomm Flagship Chip Performance Soars, Bursting the Toothpaste!
芯东西
➀ Qualcomm has officially launched the new generation of annual flagship mobile phone SoC, Snapdragon 8 Elite, and the second generation of Qualcomm Oryon CPU for AI PCs.
➁ Snapdragon 8 Elite features the new Hexagon NPU that supports on-device multimodal and 4k context windows.
➂ The CPU of Snapdragon 8 Elite, known as the "global fastest mobile CPU", is the second-generation customized Qualcomm Oryon CPU, using TSMC's second-generation 3nm process technology.
- The Story Behind 'Special' Server Models and CPUs
IT技术分享-老张
➀ Special server models like SA5212 M5 and CPU models like Intel Xeon 8375C are created to cater to specific industries, such as the internet industry, to avoid impacting traditional industries and maintaining high prices for those markets.
➁ These special models often come from sources like outdated equipment, major clients' canceled orders, and irregular channels, which can lead to low prices in the market.
➂ Special models are generally cost-effective, but some are designed for high-profit margins, especially in industries that are less price-sensitive.
➃ Server manufacturers can request custom CPU models, but large CPU manufacturers like Intel and AMD usually only offer this service to major end-users or provide discounted models in their regular lists.
- ECOC2024: Lasers and Their Packaging Devices
Unknown
➀ Introduction of wavelength locking chips based on silicon photonics, highlighting their trend, functionality, and challenges with temperature dependence.
➁ Discussion on passive optical isolators based on silicon photonics, focusing on optical Kerr effect and micro-ring resonators.
➂ Presentation of a tunable C+L band laser, featuring a novel TOSA with over 100nm tuning range and high output power.
October 21
- Soaring High! SMIC Sets New Record High!
半导体技术天地
➀ SMIC's A-share stock surged, hitting a historical high of 105 yuan at one point during the morning trading session on October 21, with a closing price of 97.48 yuan, up 8.14% from the previous day, marking another historical high.
➁ The stock's year-to-date increase is 70.72%, outperforming the 12.10% rise in the Shanghai-Hong Kong Stock Connect Index.
➂ The rise in SMIC's stock is seen as a sign of the A-share semiconductor market's strength. Analyst Mo Wenyu from XinDa Securities attributes the rise to the strong sci-tech nature of the semiconductor industry and its role as an important part of new quality productivity. The recovery trend in the semiconductor industry is becoming clearer with continuous policy support from the government, presenting long-term investment opportunities.
- Chip Employees: Making Millions, No Time to Spend!
半导体技术天地
➀ Employees at NVIDIA report long work hours and high workloads, with some working until 1 or 2 AM;
➁ Meetings at NVIDIA are described as chaotic with shouting and even physical fights;
➂ Despite the pressure, some employees enjoy the work and the chance to solve interesting technical problems;
➃ The article mentions that after working at NVIDIA for five years, employees can earn over a million dollars, making it a place where millionaires are common;
➄ Some employees share their high salaries, with one employee earning over 11 million yuan in December 2021.
- TCL Zhonghuan's Suspected Mass Resignation
半导体技术天地
➀ TCL Zhonghuan, a leading photovoltaic silicon wafer company, has significantly reduced its production rates, possibly facing a wave of employee resignations.
➁ Employees have reported that since August, multiple production bases of Zhonghuan have started to arrange for rest days, resulting in significantly lower wages in October.
➂ There are at least hundreds of employees who have demanded compensation plans from the company's management. Some employees are currently in negotiations with the company, which has promised to provide solutions by October 21st.
- An All-around Explanation of CMP: Deep Dive into Chemical Mechanical Polishing Technology
Semiconductor Materials and Technology
➀ CMP technology combines chemical and mechanical actions for surface planarization;
➁ CMP plays a crucial role in semiconductor manufacturing, including initial wafer flattening, metal interconnect structure fabrication, and chip packaging;
➂ Key components of CMP equipment include polishing heads, polishing pads, and polishing slurries, each requiring precise control and optimization;
➃ CMP technology faces challenges such as nanometer-level precision, adaptation to new materials, and environmental and cost pressures;
➄ The future of CMP technology includes technological advancement, market demand growth, and a diversifying industry landscape.
- What is the Ashing Process for Removing Photoresist
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➀ The ashing process is used to remove photoresist after etching, as it is no longer needed.
➁ Originally, wet methods were used for removing photoresist after etching, but they could not remove the degraded photoresist during etching.
➂ Dry etching became mainstream, and ashing in dry processes started in the late 1970s.
➃ Dry plasma ashing has the advantages of high ashing rate and reliability.
➄ The process involves plasma and gas diffusion in a vacuum chamber.
➅ The photoresist's main components are resins, photoactive materials, and organic solvents, all consisting of long-chain carbon, hydrogen, and oxygen molecules.
➆ Oxygen plasma ashing uses highly reactive atomic oxygen to react with the carbon-hydrogen-oxygen polymer compounds in the photoresist, forming volatile reactants and removing the photoresist layer.
- 4 Chinese SiC Projects Reach New Milestones: Over 13.4B Yuan, Set for Year-End Commissioning!
行家说三代半
➀ Several Chinese SiC projects have reached new progress, with total investment exceeding 13.4 billion yuan.
➁ Shilanwei's 8-inch SiC project is in the final phase of civil engineering, expected to be put into trial production in Q4 2025.
➂ Yuqin Semiconductor's SiC crystal material research and industrialization project has a capacity of 840 ingots per year.
➃ Xujie Energy's headquarters and SiC/GaN industrialization project is expected to be completed and put into use by the end of the year.
➄ Shandong University and Zhongjing Xinyuan have signed a project to develop 8-inch SiC single crystal growth and substrate processing technology.
- Yu Renrong of Weilai Shares: The 'Three Investments' That Stirred the Industry
尺度商业
➀ Yu Renrong, the CEO of Weilai Shares, plans to donate 25 million shares worth 2.8 billion yuan to the Ningbo Oriental Polytechnic University Education Foundation.
➁ Yu's donation is part of a larger plan to donate over 30 billion yuan to support the university's development.
➂ Yu's success is attributed to his leadership in Weilai Shares' growth and investments in the semiconductor industry, including the acquisition of CMOS image sensor leaders.
➃ As a personal investor, Yu has also invested in at least 10 semiconductor private equity funds and has seen significant returns from his investment in Zhongke Feicel.
➄ Yu is currently waiting for the IPO of a new company, Xinhenghui, in which he is a major shareholder.
- India's Chip Industry: A Deep Dive!
半导体行业观察
➀ India's semiconductor industry has made significant progress under the government's $76 billion incentive fund for the India Semiconductor Mission (ISM) launched in December 2021.
➁ The first phase of ISM has approved five semiconductor projects, including four chip packaging factories and one chip manufacturing factory, to be operational between 2025 and 2027.
➂ Experts are urging the next phase of ISM to focus on partnerships with global semiconductor leaders, expanding the ecosystem for raw materials like chemicals and gases, and increasing efforts to train skilled talent for the growing industry.
- Material Giants Plan for Glass Substrate, How Special Glass Becomes Key for AI
半导体行业观察
➀ Intel has officially launched the industry's first glass substrate for next-generation advanced packaging and plans to mass-produce it by the second half of this century, sparking a discussion about glass substrates in the industry.
➁ The advantages and disadvantages of glass substrates have been shared by packaging giants like Intel over the past year, but there is still some skepticism about switching from organic substrates to a new material.
➂ Glass substrates have become a key factor in advanced packaging due to their advantages over traditional organic substrates, such as high heat tolerance and increased interconnect density.
- Next-Generation Chip Technology: New Breakthroughs
Semiconductor Industry Observation
➀ A new study shows that using 'chaotic edges' can greatly simplify electronic chips, as chaotic edges can amplify signals and act as superconductors, reducing the need for separate amplifiers and lowering power consumption.
➁ Researchers have discovered how 'chaotic edges' help electronic chips overcome signal loss, making them simpler and more efficient.
➂ By using metal lines on semi-stable materials, this method allows long metal lines to act like superconductors and amplify signals, potentially changing chip design by eliminating the need for transistor amplifiers and reducing power consumption.
- TSMC Surging to Become the World's Largest Packaging Factory?
Semiconductor Industry Observation
➀ TSMC is the leading player in the semiconductor industry.
➁ Advanced packaging is becoming a key technology path for chip performance improvement.
➂ TSMC is expected to become the largest packaging service provider with the rapid adoption of Chiplet architecture.
➃ TSMC has invested heavily in advanced packaging technology, with capacity set to grow significantly.
➄ TSMC's CoWoS, InFO, and SoIC technologies are driving the company's leadership in advanced packaging.
➅ TSMC is expanding its capacity to meet the increasing demand for advanced packaging.
➆ TSMC is also investing in optical packaging technology to meet the growing bandwidth needs.
- ECOC2024: EML Innovations and Developments
光芯之路
➀ ECOC2024 showcased EML advancements, focusing on bandwidth enhancement through capacitor optimization.
➁ Broadcom presented a hybrid CMBH-Ridge O波段EML with 75GHz 3dB BW and 7dBm output power, suitable for PAM4 (240 Gbits/s) applications.
➂ Orange and Sumitomo's DFB-EAM-SOA achieved +13.3 dBm average emission power for 50G PON, exceeding D-level requirements.
➃ III-V-on-Si chip-on-EML demonstrated by III-V Lab, Nokia, offered 16 mW chip power and 22 GHz bandwidth.
➄ McGill University and Lumentum Japan achieved 200 Gbps IM/DD transmission over 80 km using InP EML and QD-SOA.
- High-Speed Packaging Technology and Reliability of Optical Chips
光通信女人
➀ Optical chips used in optical modules are made of various crystal materials and are very delicate.
➁ The packaging technology for different types of chips varies.
➂ The continuous advancement of AI's computing power drives the industry towards high-speed optical modules and raises market expectations.
➃ High-speed optical modules have characteristics such as high speed, large bandwidth, high power consumption, and increased attention to reliability due to internal temperature rise.
➄ Some processes affect both bandwidth and reliability.
➅ Packaging technology is a crucial part of the entire industry chain.
- Explosive HBM Demand Expected to Push DDR5 Pricing Up by 20%!
SSDFans
➀ The demand for HBM is rapidly growing due to the surge in AI server needs, with supply for 2024 and 2025 already sold out by Micron and SK Hynix.
➁ TrendForce analysts predict a 5% to 10% increase in HBM memory prices next year, with DDR5 prices expected to rise by 15% to 20%.
➂ HBM is much more expensive than standard DRAM, about five times the cost of DDR5, but its performance and capacity advantages justify the higher cost.
- AI Network Background: Why, What & How of RDMA
架构师技术联盟
➀ The need for RDMA in high-performance computing, big data storage, and machine learning domains;
➁ Detailed introduction of RDMA network architecture, key components, and protocols;
➂ Explanation of the RDMA working mechanism, including software configuration and hardware design;
➃ Overview of RDMA technology protocols such as InfiniBand, iWARP, and RoCE;
➄ Future technological innovations and challenges for RDMA, including scalable RDMA controllers, efficient QP management, congestion control, network topology optimization, and security.
- Why Intel Launched OCSP? The Background and Goals of Intel's Open Common Server Platform
IT技术分享-老张
➀ The background of Intel OCSP: The server market is highly competitive with significant pressure on small and medium-sized brands, and profits of large manufacturers are thin.
➁ The初衷 and goals of Intel OCSP: To help small manufacturers reduce development pressure and deepen the Intel server ecosystem.
➂ The scope and objectives of Intel OCSP: To define open standards for server components like cases, power supplies, motherboards, etc., to build a healthy server component ecosystem in China.
October 20
- The Midfield Battle of Domestic CPUs
新流研究
➀ The domestic CPU industry is entering a new stage with the expanding market demand for domestic processors, marked by three major routes: x86 architecture, ARM architecture, and LoongArch architecture;
➁ The core of evaluating domestic processors today should be how to find a balance between the two routes and let some routes develop first, with x86 and ARM showing significant potential while LoongArch carries the initial vision of independent development;
➂ The three routes complement each other, with x86 and ARM leading the market and LoongArch focusing on ecosystem development and performance improvement.
- Should Domestic Chip Start-ups Continue Financing?
芯师爷
➀ Chip start-ups in China have been facing a series of deep reflections over the past six years.
➁ The opportunities in the chip industry are cyclical and have an element of chance.
➂ The Chinese chip market may not be able to accommodate many domestic chip companies, and the industry is heading towards polarization.
➃ The two possible outcomes for domestic chip start-ups are listing or acquisition.
➄ The era of 'survival of the fittest' has passed in the Chinese chip industry, and only the 'winner takes all'.
- Collaborating with HarmonyOS Starlink, Creating an Intelligent IoT | Xinhai Technology Debuts at the 6th Core Chip Eco-System Conference
芯师爷
➀ The conference gathered hundreds of industry elites to discuss technological innovation opportunities and promote the strong development of China's semiconductor industry.
➁ Liu Longguang, General Manager of Xinhai Technology's AIoT product line, delivered a speech on 'Collaborating with HarmonyOS Starlink, Xinhai Technology Creates a New Era of Intelligence', showcasing the company's achievements in the HarmonyOS ecosystem.
➂ Xinhai Technology has developed a full-signal chain technology platform, providing an AIoT overall solution to create a differentiated competitive advantage and actively integrate into the HarmonyOS ecosystem.
- Intel and AMD Alliance to Counter Arm, but Cannot Halt Cloud Firms' Self-developed Arm
云体验师
➀ Intel and AMD have formed the 'x86 Advisory Group' to counter Arm.
➁ Cloud firms like AWS are developing their own Arm processors, lowering costs and increasing flexibility.
➂ Intel and AMD have responded with high-core-count processors, but cloud firms are continuing to develop their own Arm processors.
- China's Electric Vehicle Market Captures 66% of Global Market, Yet Relies on Imports for 90% of Chips!
芯智讯
➀ China's electric vehicle market captures 66% of the global market with a monthly sales record of 1.1 million vehicles in September 2024;
➁ China's market share in the global electric vehicle market reached 720,000 vehicles from January to September 2024, with a year-on-year growth rate of 35%;
➂ China's electric vehicle industry faces the issue of over-reliance on imported chips, with more than 90% of chips being imported, and the dependency rate of computing and control chips reaching 99%;
➃ The Chinese government plans to increase the proportion of domestically purchased auto chips to 20%~25% by 2025.
- Semiconductor Manufacturing at a New Inflection Point?
Semiconductor Industry Observation
➀ The semi-damascene technique, when combined with patternable metals like Ru, promises to achieve RC, area, cost, and power efficiency for interconnect scaling paths.
➁ The introduction of CU DUALdamascene in BEOL in 1997 marked a turning point in semiconductor history, shifting from subtractive Al patterning to wet processes like copper electroplating and CMP.
➂ Imec proposed a new metallization concept called 'semi-damascene' in 2020, which starts with direct patterning of the first local interconnect metal layer and then uses a single inlaid technique for the vias.
- 多位院士领衔，第二届集成芯片和芯粒大会开放注册！
半导体行业观察
➀ The 2nd Integrated Chip and Chiplet Conference will be held in Beijing from November 8 to 10, 2024, with the theme 'Integrated Chip: Stepping into the Era of Large Chips';
➁ The conference is organized by the Institute of Computing Technology of the Chinese Academy of Sciences and Fudan University, focusing on the cutting-edge dynamics and future development trends of integrated chips and chiplets;
➂ The conference will feature theme speeches, expert roundtable forums, black technology releases, technical forums, and open-source community competitions, discussing key issues in the field of integrated chips and chiplets.
- Why Layout Engineers Must Learn FinFET? 'Advanced FinFET Process Simulation Layout Design' Online Live Class Registration!
Semiconductor Industry Observation
➀ The advancement in semiconductor manufacturing processes, such as the transition from 28nm to 12nm FinFET, is driven by the need for higher integration, processing power, and lower power consumption to meet the growing demand in AI, high-performance computing, automotive electronics, 5G communication, and the Internet of Things.
➁ FinFET technology, with its innovative 3D structure, addresses the size scaling and performance bottlenecks of planar transistors, becoming a key technology to extend Moore's Law.
➂ The course offered by E课网 aims to teach advanced FinFET layout design skills in just two weeks, providing real-world project experience and preparing students for higher salaries and career development.