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  • The Ultimate Guide to DFN Package

    ➀ The DFN (Dual Flat No-leads) and QFN (Quad Flat No-leads) packages are gaining popularity in high-performance applications due to their compact size and advanced circuitry support.

    ➁ These packages are used in a wide range of applications, from consumer electronics to automotive systems.

    ➂ Understanding their specifications can significantly enhance design strategies and product development.

  • April 15

  • Vertex Growth announces commitment of €10M investment in Dolphin Semiconductor to accelerate growth strategy

    ➀ Vertex Growth, a Singapore-based growth-stage venture capital fund, has announced a €10M investment in Dolphin Semiconductor;

    ➁ The investment aims to support and accelerate the growth strategy of Dolphin Semiconductor;

    ➂ Dolphin Semiconductor is a leading provider of semiconductor IP solutions specializing in mixed-signal IP design.

  • April 14

  • GSME Secures $18 Million Growth Investment

    ➀ GS Microelectronics (GSME) has secured $18 million in growth investment;

    ➁ The investment is from a consortium of strategic partners and technology funds;

    ➂ The funds will be used to fuel GSME's growth plans including portfolio diversification and global service expansion.

  • Omni Design Technologies Offers 3nm, Single Core-voltage Supply Rail Process, Voltage and Temperature (PVT) Monitor

    ➀ Omni Design Technologies announced the availability of its high-precision PVT monitor;

    ➁ The ODT-PVT-ULP-001C-3 integrates seamlessly with a single core-voltage supply and a digital interface;

    ➂ The monitor supports 3nm technology and single core-voltage supply rail process.

  • April 9

  • Hailo Selects Avnet ASIC as Channel Partner for TSMC Silicon Production

    ➀ Hailo, a pioneering chipmaker of edge AI processors, has selected Avnet ASIC as its silicon channel partner for future chip production.

    ➁ Avnet ASIC is a leading provider of ASIC and SoC full turnkey solutions and a business division of Avnet Silica.

    ➂ The collaboration is for future chips to be produced using TSMC's silicon technology.

  • CEO Talk: Bharath Desareddy, CEO of SmartSoC Solutions

    ➀ Tell me a bit about your background? How did you first get started with SmartSoC Solutions?

    ➁ After completing my education in engineering, I started my career in the semiconductor industry, working on silicon design and implementation.

    ➃ Over the years, I gained...

  • April 8

  • Cyient Announces the Launch of Semiconductor Subsidiary

    ➀ Cyient, a global engineering and technology solutions provider, has launched its fully owned semiconductor subsidiary, Cyient Semiconductors.

    ➁ The move aims to strengthen Cyient's commitment to innovation and excellence in the global semiconductor market.

    ➂ Cyient Semiconductors will leverage Cyient's expertise in semiconductor design.

  • April 1

  • imec to set up €40m chiplet development centre in Germany

    ➀ imec, a leading nanoelectronics and digital technologies research center, is establishing an Advanced Chip Design Accelerator (ACDA) in Baden-Württemberg, Germany.

    ➁ The €40 million center is funded over the next five years.

    ➂ The focus is on advancing automotive chiplet technology, enhancing Germany and Europe's position in this field.

  • Taiwan chipmaker UMC launches US$5 billion wafer fab facility in Singapore; 700 jobs to be created

    ➀ Taiwan's United Microelectronics Corporation (UMC) has launched a new US$5 billion wafer fabrication facility in Singapore;

    ➁ The facility, located in the Pasir Ris Wafer Fab Park, features a 22nm wafer fabrication process;

    ➂ The event was attended by senior Singaporean officials, highlighting the importance of the project.

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