March 17
➀ The automotive industry is experiencing a revolution with the rise of software-defined vehicles and AI integration.
➁ Traditional ECU architectures are shifting towards centralized and zonal designs for efficiency and data handling.
➂ Soitec's FD-SOI technology is crucial for enhancing performance, energy efficiency, and reliability in next-generation automotive applications.
March 14
➀ Axelera AI, founded in 2021, aims to provide scalable edge AI hardware and software solutions.
➁ The company has raised USD 120 million and has a world-class team of over 190 employees.
➂ Axelera AI's Metis platform offers high performance with low power consumption, targeting applications like computer vision, automotive, and healthcare.
March 13
➀ The resolution in lithography is influenced by image blur in addition to wavelength and numerical aperture, which impacts image contrast and sensitivity to stochastic effects.
➁ Blur originates from various factors including flare, image fading, stage desynchronization, and electron behavior.
➂ Incorporating electron blur into lithography models is crucial for improving image resolution and reducing defectivity in advanced semiconductor manufacturing.
➀ Siemens EDA在AI方面的深度，包括1400名AI专家和近4000项专利；
➁ 随着芯片复杂性的增加，行业预计到本世纪末将短缺27,000名专家设计师；
➂ Siemens利用三种类型的AI在验证领域：基于无监督学习的分析型AI、基于机器学习和统计分析的预测型AI，以及基于大型语言模型的生成/代理支持型AI。
March 12
➀ Dinesh Bettadapur is the CEO of Irresistible Materials, a company specializing in EUV resist materials for semiconductor manufacturing.
➁ The company's MTR™ platform addresses limitations of traditional resist materials and offers significant cost savings.
➂ Irresistible Materials focuses on collaboration with leading semiconductor manufacturers and developing innovative solutions for EUV lithography.
March 11
➀ Finwave Semiconductor CEO Pierre-Yves Lesaicherre discusses his extensive experience in the semiconductor industry and his leadership at Finwave.
➁ The company's strategic partnership with GlobalFoundries for GaN-on-Si technology development and licensing is highlighted.
➂ Lesaicherre addresses the challenges of introducing new technology and the company's solutions for high-frequency RF communications.
March 10
➀ This article discusses the challenges of physical design verification for custom and analog/mixed-signal IC designs.
➁ It introduces Siemens' Calibre Pattern Matching tool for early-stage physical verification.
➂ The tool allows for interactive symmetry checking and early IP placement verification, reducing design time and improving quality.
March 7
➀ S2C在亚太地区2024年Arm技术研讨会后，推出了针对智能视觉物联网和下一代汽车技术的解决方案；
➁ S2C的基于Arm的智能视觉参考设计和混合MCU原型设计平台，帮助开发者加速产品开发，提高效率；
➂ S2C与Arm的合作，为开发者提供了加速创新和满足对更智能、更高效解决方案不断增长需求的途径。
March 6
➀ The article discusses the role of AI experts in advancing AI for design and verification.
➁ It highlights the potential of AI in revolutionizing productivity and the challenges it poses in terms of precision in engineering.
➂ The company AlphaDesign, founded by William Wang, is introduced, focusing on their solution ChipAgents™ which uses LLM agents for design and verification tasks.
March 5
➀ Dr. Prady Gupta is the Founder and Chief Scientist at Infinita Lab and Infinita Materials, focusing on materials testing and specialized chemicals for high-tech industries.
➁ Infinita Lab offers a network of over 2,000 accredited labs for comprehensive materials testing services.
➂ Infinita Materials specializes in custom inorganic chemicals for sectors like semiconductors and batteries.
March 4
➀ Sherwin-Williams is a global leader in protective coatings for semiconductor fabs.
➁ The company addresses challenges like tight deadlines and labor shortages with efficient solutions.
➂ Steve Howington emphasizes the company's partnership approach and expertise in semiconductor construction.
➀ The complexity of semiconductor chip design has increased the demand for scalable cloud solutions in post-tapeout flow management.
➁ Cloud platforms offer dynamic scaling and cost-effective resource management.
➂ Strategic partnerships and cloud services like Siemens EDA and AWS are revolutionizing PTOF processes.
March 3
➀ yieldHUB在2024年扩展了其数据科学团队，推动了AI集成和现有客户基础的扩大；
➁ 公司面临在开发下一代平台的同时满足当前平台增长需求的挑战；
➂ yieldHUB即将推出yieldHUB Live，这是一款AI驱动的实时监控系统，旨在改进测试流程和减少停机时间。
➀ Engineered substrate technology is driving the semiconductor industry from traditional planar scaling to innovative materials and 3D integration.
➁ Companies like Soitec, Intel, and Samsung are leading the adoption of this technology.
➂ Foundries are increasingly recognizing the strategic importance of engineered substrates like Fully Depleted SOI (FD-SOI) for their benefits in cost and performance.
February 28
➀ Cycuity specializes in semiconductor security products and services.
➁ The Radix platform provides early detection of security weaknesses.
➂ Dr. Kuehlmann emphasizes the importance of security in semiconductor design.
February 27
➀ AI software modeling represents a significant shift from traditional programming, enabling systems to learn from data.
➁ The complexity of AI systems lies in their model parameters, which can number in the billions or trillions.
➂ GPUs have become essential for AI processing, but they face efficiency challenges, particularly during inference with large language models.
February 26
➀ The semiconductor industry is transitioning from monolithic to multi-die designs, driven by complex AI software.
➁ Arteris is addressing challenges like the 'memory wall' with cache-coherent NOC technology.
➂ Arteris's Magillem technology helps manage and integrate numerous IP blocks in modern designs.
➀ This paper discusses the post-silicon validation of the IBM POWER9 processor, highlighting its significance in the context of increasing multi-core processor adoption by hyperscalers.
➁ IBM's Threadmill, a tool for processor verification, has been enhanced since the POWER7, including optimized template allocation and debugging strategies for multi-core write drops.
➂ The validation methodology for POWER9 has significantly improved bug detection rates compared to POWER8, with new techniques like AI prioritization and hardware irritators to induce bugs.
February 25
➀ MSquare Technology has achieved significant milestones in Chiplet technology with the launch of the ML100 IO Die.
➁ The company faced challenges in 2024 due to macroeconomic factors and technical hurdles but turned them into growth opportunities.
➂ MSquare's solutions are addressing the rapid expansion of AI and data centers with innovative Chiplet solutions.
➀ Synopsys has expanded its Hardware-Assisted Verification (HAV) portfolio to address the growing complexity of chip design.
➁ The new solutions aim to accelerate semiconductor design and system validation.
➂ Key products include the next-generation hardware engines ZeBu-200 and HAPS-200, offering significant performance improvements.
February 24
➀ Generative AI has evolved with the rise of transformer models, improving accuracy and enabling automated creation.
➁ Running Gen AI on the edge addresses challenges like latency, privacy, and limited connectivity.
➂ Synopsys offers specialized NPUs for efficient edge-based Gen AI processing.
➀ A new chiplet-based RISC-V vector processor architecture aims to balance performance, efficiency, and flexibility for AI workloads.
➁ The architecture utilizes modular chiplets, including a vector processing chiplet and a matrix multiplication accelerator, to optimize various AI computation aspects.
➂ The RISC-V solution addresses memory bottlenecks and enhances energy efficiency with time-based execution and dynamic power gating.
February 23
➀ EUV和DUV在20nm间距下都是可行的选项；
➁ 在20nm间距下，EUV和DUV方法可以实现类似的特征尺寸和分辨率；
➂ 即使在EUV光刻中，2nm节点的任何双曝光方案仍然需要成像10nm线宽。
February 21
➀ Alpha Design AI is revolutionizing chip design and verification with ChipAgents, an AI tool that automates debugging and verification processes.
➁ The company is led by CEO and founder Dr. William Wang, who is also a professor at UC Santa Barbara.
➂ ChipAgents addresses industry challenges by integrating with existing EDA tools and reducing design cycle time.
February 20
➀ Sri Lakshmi Simhadri discusses MosChip's achievements in 2024;
➁ Challenges faced in adapting to market changes and hiring skilled professionals;
➂ Insights on the biggest growth area for 2025 in the semiconductor industry.
➀ Soitec通过其Smart Cut™技术和工程化基板，推动了芯片性能和功率效率的提升；
➁ 公司在移动通信、汽车应用和人工智能数据中心的硅光子技术方面发挥着关键作用；
➂ Soitec致力于成为半导体材料领域的可持续领导者，推动技术创新与环境保护的结合。
February 19
➀ Traditional RF board design strategies are insufficient for high frequencies and dense layouts;
➁ Keysight and Modelithics collaborate on an advanced RF board simulation workflow;
➂ The use of 3D passive component models enhances simulation accuracy and reduces the risk of board re-spins.
➀ sureCore专注于低功耗内存解决方案，显著降低了SRAM和其他嵌入式内存的功耗；
➁ 2024年，sureCore成功实施了低功耗内存编译器，并领导了一个开发量子计算机低温IP的项目；
➂ 公司预计AI和智能医疗解决方案将在2025年推动增长，同时继续在超低功耗内存技术上进行创新。
February 18
➀ Samtec showcased its Si-Fly® HD 224 Gbps PAM4 interconnect technology at DesignCon, collaborating with Broadcom.
➁ The demo featured Broadcom’s 200 Gbps SerDes technology and Samtec’s high-speed cable systems.
➂ The collaboration aims to enhance system performance and open new horizons in multi-channel SerDes technology.
February 17
➀ Alchip预计2024年营收将超过10亿美元，实现重大里程碑；
➁ 公司专注于先进技术，包括2nm测试车间的发布和3DIC设计流程的准备工作；
➂ Alchip通过灵活且强大的3DIC设计流程应对先进封装的挑战，优化功率传输、互连和热特性。