Logo

SemiVoice

thelec

thelec.net 主要提供关于SK Hynix、Samsung等韩国半导体行业的最新新闻,包括HBM、DRAM和NAND等信息。

今天

  • Hanmi Semiconductor wins order from Micron to supply 50 TC bonders

    ➀ Hanmi Semiconductor has secured a significant order from Micron;

    ➁ The order is for thermal compression (TC) bonders used in HBM production;

    ➂ The deal is likely the reason for the increased TC bonder prices for Hanmi's other customer, SK Hynix.

  • Korea Wafer Holdings to demand 3S Korea open the books

    Korea Wafer Holdings, the largest shareholder of 3S Korea, is planning to send an official demand letter next week. The letter will request the company to open their accounts and certify copies of accounting documents. These documents are sought for a comprehensive review, including those related to financial and operational matters.

  • April 16

  • 3S Korea’s new owner prepare for shakeup after 'mismagement'

    3S Korea's new majority shareholder is preparing for a major reshuffle of the company's executives following allegations of 'mismangement' by the previous largest shareholder. Korea Wafer Holdings, having spent 13.7 billion won on April 1 to acquire a 12% stake in the wafer shipping box manufacturer, is scrutinizing the previous shareholder's management practices.

  • April 15

  • Samsung Foundry keeps fined foundry partner in supply chain

    ➀ Samsung Foundry has named Wethemax as its Design Solution Partner (DSP) earlier this year;

    ➁ TheElec discovered that Wethemax was fined 10 billion won by the foundry last year for malpractice;

    ➂ This is an unusual move for Samsung, known for its strict supplier policies.

  • April 14

  • SK Hynix to increase facility spending by 30% amid HBM demand surge

    SK Hynix has decided to increase its planned CAPEX by 30% this year due to the surge in demand for high-bandwidth memory (HBM). Initially planning to spend 22 trillion won on facility expansion, the company has now increased this to 29 trillion won, according to sources.

  • April 11

  • SK Hynix beats Samsung to becomes top vendor of DRAM for the 1st time

    SK Hynix has become the world's largest vendor of DRAM based on revenue for the first time in its history. According to Counterpoint Research, in the first quarter of this year, SK Hynix held a 36% market share in the DRAM market, followed by Samsung with 34% and Micron with 25%. This milestone marks a significant shift in the DRAM market landscape.

  • April 9

  • E-beam firm SEC eyes HBM, TGV, 4680 battery for future growth

    Electrical beam equipment manufacturer SEC, known for supplying X-ray inspection systems, is more than just an X-Ray equipment maker. The company leverages its e-beam technology to offer non-destructive inspection platforms that are more cost-competitive and flexible in design. SEC CEO Jongh discusses the company's future growth strategies.

  • April 7

  • Korean fab equipment makers see profit jump from HBM, advanced packaging

    South Korean fabs saw a profit increase last year, primarily due to high-bandwidth memory (HBM) and advanced packaging technologies. TheElec analyzed the financial filings of 46 major fab equipment manufacturers in the country.

    Hanmi Semiconductor, one of the companies reviewed, experienced a notable rise in profits.

  • April 1

  • SFA supplies inspection kit for HBM and glass substrates to major chipmaker

    SFA has developed three different kinds of metrology and inspection (MI) machines and has supplied one of them to a major South Korean chipmaker.

    The company has supplied a white light interferometry (WLI)-based height measurement machine to the conglomerate and plans to supply four additional units.

  • Zeus sees revenue jump last year thanks to HBM

    Zeus, a South Korean semiconductor equipment manufacturer, reported revenue of 315.7 billion won last year, a 69% increase from 2023, according to its filings on Monday. It also returned to profitability with an operating income of 39.1 billion won. This growth is attributed to Zeus's timely development of cleaners for high-bandwidth memory.

  • SemiVoice 是您的半导体新闻聚合器,探索海内外各大网站半导体精选新闻,并实时更新。在这里方便随时了解最新趋势、市场洞察和专家分析。
    📧 [email protected]
    © 2025