SemiVoice

➀ Samsung plans to produce Tesla's AI chip Dojo using its cutting-edge 2nm process technology;

➁ The 2nm node will also be leveraged to fabricate the SoC for Tesla's humanoid robot Optimus;

➂ Initial manufacturing preparations have begun at Samsung's Taylor, Texas semiconductor facility.

➀ Cooling technology is predicted to become the main competitive factor in the HBM market by 2029, coinciding with HBM5 commercialization;

➁ Current semiconductor market dominance is driven by packaging innovations, but focus will shift to cooling solutions in the future;

➂ Immersion cooling is expected to play a critical role in advancing HBM5 performance and market adoption.

➀ QRT announced it will unveil a new RF device reliability testing equipment at IMS2025;

➁ IMS2025 is the largest annual symposium for the microwave and RF industry, showcasing new technologies;

➂ The event will highlight advancements in RF device verification and industry collaboration.

➀ Neowine has developed a repair technology for HBM controllers, achieving a 99% yield rate;

➀ The patent-pending innovation involves redesigning Mux (Multiplexer) logic circuits;

➂ The advancement aims to enhance efficiency in HBM production and semiconductor manufacturing processes.

➀ South Korean semiconductor equipment maker PSK secured a partial invalidation of Lam Research's patent for a gap controllable bevel etcher (Patent No. 1433411);

➁ The Intellectual Property Trial and Appeal Board of Korea ruled specific claims (Articles 1, 2, 5, 13, 19, 20) of Lam's patent invalid;

➂ The decision marks a significant development in intellectual property disputes within the semiconductor manufacturing equipment sector.

➀ Hanmi Semiconductor publicly removed Hanwha's equipment signboard while showcasing its new customer support office near SK Hynix's HBM production base;

➁ The symbolic move highlights intensifying competition among SK Hynix's memory equipment suppliers;

➂ The office location strategically positions Hanmi closer to SK Hynix's key HBM fab in Icheon, South Korea.

➀ China emerged as the top spender on semiconductor fab equipment in 2024;

➁ The country invested $49.55 billion in this sector, marking a 35% year-on-year increase;

➂ This expenditure solidified China's position as the world's largest semiconductor equipment market.

➀ Samsung will cease its multi-level cell (MLC) NAND flash memory production;

➁ Orders for MLC NAND chips will only be accepted until next month;

➂ The company informed a customer about price increases, prompting them to seek alternative suppliers.

➀ South Korean semiconductor equipment manufacturers Park Systems and Jusung Engineering reported strong Q1 2024 earnings, driven predominantly by sales in China;

➁ Their growth aligns with China's semiconductor self-sufficiency efforts amid US-China trade tensions, leveraging opportunities in advanced equipment procurement;

➂ Over 50% of Park Systems' revenue and 40% of Jusung Engineering's revenue in Q1 came from China, highlighting the region's strategic importance.

➀ ISTE anticipates generating revenue in 2024 from plasma-enhanced chemical vapor deposition (PECVD) equipment due to HBM market expansion;

➁ The company identifies the current timing as optimal for entering the silicon carbon nitride (SiCN) PECVD equipment market;

➂ This aligns with surging demand for advanced packaging technologies driven by HBM's requirements, including 3D IC and through-silicon via (TSV) processes.

➀ Samsung plans to outsource photomask production for memory chips, a shift from its previous in-house strategy aimed at preventing technology leaks;

➁ The company is evaluating suppliers to manufacture low-end photomasks, indicating potential diversification in its supply chain;

➂ This move reflects Samsung's strategic adjustments in semiconductor manufacturing processes amid evolving industry demands and technological complexities.

➀ Huawei operates at least 11 semiconductor fabs, expanding to 20 including R&D facilities;

➁ Facilities produce memory chips (including DRAM) and logic chips for IoT/mobile devices;

➂ Expansion supports China's semiconductor self-reliance strategy amid US export restrictions

➀ Philoptics developed an inspection kit for through glass via (TGV) holes to verify proper punching on glass substrates;

➁ The equipment generates 2.5D images by capturing side views of holes, enabling precise defect detection;

➂ This innovation enhances quality control in advanced semiconductor packaging processes.

➀ Samsung's HBM3E memory is set to undergo NVIDIA's final quality tests in June for supply approval;

➁ The company passed NVIDIA's audit at its Onyang Campus in March, meeting minimum technical requirements;

➂ The development marks a critical milestone in Samsung's efforts to supply HBM3E for AI and high-performance computing applications.

➀ Chipmaker Sigetronics announced the successful manufacturing of MOS Controlled Thyristor (MCT), a semiconductor device for power switching;

➁ MCT can control large power and current, making it suitable for high-performance applications;

➂ The technology is utilized in military weapon systems and radar equipment due to its robust capabilities.

➀ SK Hynix reported Q1 2023 revenue of 17.63 trillion KRW and operating profit of 7.44 trillion KRW, marking its second-highest quarterly performance to date;

➁ Both figures slightly trailed the record highs set in the previous quarter;

➂ The company achieved a staggering 734% year-over-year increase in operating profit, driven by strong demand for memory solutions amid the AI and HPC boom.

➀ SK Hynix successfully verified its CXL 2.0 DRAM technology with a customer;

➁ The new CMM DDR5 96GB module offers 50% higher capacity and 30% wider bandwidth than previous DDR5 versions;

➂ Capable of processing 36GB of data per second, enhancing memory performance for advanced computing applications.

Hanmi Semiconductor’s thermal compression (TC) bonders supplied to Micron for the production of high-bandwidth memory (HBM) have achieved higher yield rates than those supplied by Shinkawa, a Japanese rival, according to TheElec. Hanmi Semiconductor recently recalled its customers’ feedback to confirm the superior performance of its bonders.

➀ Hanmi Semiconductor has secured a significant order from Micron;

➁ The order is for thermal compression (TC) bonders used in HBM production;

➂ The deal is likely the reason for the increased TC bonder prices for Hanmi's other customer, SK Hynix.

Korea Wafer Holdings, the largest shareholder of 3S Korea, is planning to send an official demand letter next week. The letter will request the company to open their accounts and certify copies of accounting documents. These documents are sought for a comprehensive review, including those related to financial and operational matters.

3S Korea's new majority shareholder is preparing for a major reshuffle of the company's executives following allegations of 'mismangement' by the previous largest shareholder. Korea Wafer Holdings, having spent 13.7 billion won on April 1 to acquire a 12% stake in the wafer shipping box manufacturer, is scrutinizing the previous shareholder's management practices.

➀ Samsung Foundry has named Wethemax as its Design Solution Partner (DSP) earlier this year;

➁ TheElec discovered that Wethemax was fined 10 billion won by the foundry last year for malpractice;

➂ This is an unusual move for Samsung, known for its strict supplier policies.

SK Hynix has decided to increase its planned CAPEX by 30% this year due to the surge in demand for high-bandwidth memory (HBM). Initially planning to spend 22 trillion won on facility expansion, the company has now increased this to 29 trillion won, according to sources.

SK Hynix has become the world's largest vendor of DRAM based on revenue for the first time in its history. According to Counterpoint Research, in the first quarter of this year, SK Hynix held a 36% market share in the DRAM market, followed by Samsung with 34% and Micron with 25%. This milestone marks a significant shift in the DRAM market landscape.

Electrical beam equipment manufacturer SEC, known for supplying X-ray inspection systems, is more than just an X-Ray equipment maker. The company leverages its e-beam technology to offer non-destructive inspection platforms that are more cost-competitive and flexible in design. SEC CEO Jongh discusses the company's future growth strategies.

South Korean fabs saw a profit increase last year, primarily due to high-bandwidth memory (HBM) and advanced packaging technologies. TheElec analyzed the financial filings of 46 major fab equipment manufacturers in the country.

Hanmi Semiconductor, one of the companies reviewed, experienced a notable rise in profits.

SFA has developed three different kinds of metrology and inspection (MI) machines and has supplied one of them to a major South Korean chipmaker.

The company has supplied a white light interferometry (WLI)-based height measurement machine to the conglomerate and plans to supply four additional units.

Zeus, a South Korean semiconductor equipment manufacturer, reported revenue of 315.7 billion won last year, a 69% increase from 2023, according to its filings on Monday. It also returned to profitability with an operating income of 39.1 billion won. This growth is attributed to Zeus's timely development of cleaners for high-bandwidth memory.