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thelec.net 主要提供关于SK Hynix、Samsung等韩国半导体行业的最新新闻,包括HBM、DRAM和NAND等信息。

March 14

  • Hanwha Semitech to supply 14 TC bonders to SK Hynix for HBM

    Hanwha Semitech announced on Friday that it has entered into a 21 billion won agreement to supply high-bandwidth memory (HBM) production equipment to SK Hynix. The company, previously known as Hanwha Precision Machinery, did not specify the equipment, but it is almost certain to be thermal compression (TC) bonders.

  • Seojin System posts record earnings in 2024

    Seojin System, an equipment parts manufacturer, reported its highest earnings ever last year. The company announced on Thursday that it recorded KRW 1.21 trillion in revenue and KRW 108.7 billion in operating profit last year, representing a 56% and 122% increase, respectively, from 2023. Seojin System attributed its growth to its strong sales and operational efficiency.

  • February 23

  • Lam Research molybdenum deposition machine ALTUS Halo

    Lam Research has introduced an atomic layer deposition (ALD) machine named ALTUS Halo, which utilizes molybdenum. The use of molybdenum in this machine reduces resistance by 50% compared to tungsten, ultimately accelerating application speed, according to Tae-Soon Park, Director of Lam Research, during a press conference at Semicon Korea.

  • February 21

  • Applied Materials showcases new eBeam System for chip defect detection

    Applied Materials demonstrated its new inspection kit SEMVision H20 on Thursday, equipped with the company's second-generation cold fusion emission (CFE) technology, which is three times faster than thermal fusion emission (TFE) equipment for analysis.

  • February 20

  • YEST in talks with Japan’s Kioxia to supply HPA kits

    YEST has been in discussions with Japanese NAND giant Kioxia to supply high pressure annealing (HPA) equipment. According to a company spokesperson, the talks are aimed at providing HPA equipment for Kioxia's line expansion. YEST's equipment is capable of processing 125 wafers per action, compared to the rival's 75.

  • February 19

  • Genesem supplies sorter for use in HBM testing to Korean chip giant

    Genesem, a fab equipment manufacturer, has supplied a package sorter for the final testing of high-bandwidth memory (HBM) to a South Korean chip-maker. This is Genesem's first deal of this kind with the chip-maker. The sorter is also compatible with HBM inspection equipment that Nvidia requested.

  • February 18

  • Samsung chip boss personally visited Nvidia with improved DRAM sample for HBM: Sources

    ➀ Samsung's top chip executive visited Nvidia's headquarters in the US;

    ➁ He brought a sample of the company's latest 1b DRAM;

    ➂ The purpose of the visit was to discuss the potential use of the improved DRAM for HBM.

  • February 9

  • SK Hynix kit supplier Nextin see earnings surge in 2024

    Nextin, a supplier of equipment for SK Hynix, reported on Friday that it achieved a revenue increase of over 30% and an operating income increase of 32.24% in 2024. Revenue reached 114.82 billion won, and operating income was 47.82 billion won. Nextin attributed the growth to new orders from both domestic and international markets.

  • Hanwha Precision to win order for HBM TC bonders from SK Hynix this month

    Hanwha Precision Machinery is on the verge of officially securing orders from SK Hynix for thermal compression (TC) bonders used in the production of high-bandwidth memory (HBM). Sources indicate that the equipment manufacturer is in the final stages of verification with the chip-maker.

  • January 24

  • SK Hynix records highest earnings ever in 2024

    ➀ SK Hynix reported record-breaking financial results for the year 2024 with 66.19 trillion won in revenue and 23.46 trillion won in operating income.

    ➁ The revenue saw a significant year-over-year increase of 102%.

    ➂ This marked a return to profitability after a tough year for memory chip companies in 2023.

  • January 23

  • Okins to supply chip test sockets to Samsung

    ➀ Okins Electronics announced on Wednesday that it will supply Samsung with over 400,000 units of semiconductor test sockets, valued at 6.65 billion won (approximately 11.7% of the company's revenue in 2023).

    ➁ A spokesperson for Okins Electronics stated that the majority of these sockets will be used for Samsung's production processes.

    ➂ This contract highlights the strong partnership between Okins Electronics and Samsung in the semiconductor industry.

  • Philoptics names ex-Samsung exec as head of its fab equipment business

    ➀ Philoptics has appointed a former Samsung executive as the head of its fab equipment business.

    ➁ Im Baek-gyun, who was previously the executive vice president and head of the manufacturing innovation center at Samsung DI, will take on the role of president next month.

    ➂ This move strengthens Philoptics' position in the semiconductor equipment market.

  • January 15

  • Hanmi to tune bonders supplied to SK Hynix for HBM
    ➀ Hanmi Semiconductor has signed a 10.8 billion won deal with SK Hynix for HBM production equipment; ➁ The deal involves tuning bonders supplied by Hanmi to SK Hynix; ➂ Details of the deal were not disclosed.
  • DIT supplies additional laser annealing kits to SK Hynix
    ➀ DIT announced a deal worth 20.52 billion won to supply SK Hynix with laser annealing kits; ➁ The agreement has been in place since 2023; ➂ The exact number of units supplied was not disclosed.
  • SK Hynix to reduce NAND production by 10% within 1st half of year
    ➀ SK Hynix plans to reduce its NAND production output by 10% in the first half of the year; ➁ The company has a total monthly NAND production capacity of 300,000 wafers; ➂ NAND prices have been falling for four consecutive months due to oversupply.
  • January 10

  • SK Hynix developing HBM 'faster' than Nvidia’s demand
    ➀ SK Hynix is developing high bandwidth memory (HBM) faster than customer Nvidia's demand; ➁ SK Group Chairman Chey Tae-won met with Nvidia CEO Jensen Huang at CES 2025; ➂ SK Hynix, as the most valuable subsidiary of SK Group, is manufacturing memory.
  • January 8

  • Nextin’s Wuxi operation to start production in October
    ➀ Nextin is establishing a subsidiary in Wuxi, China; ➁ The subsidiary will begin producing fab equipment in October; ➂ The operation was initially planned as a joint venture with another South Korean company, but Nextin decided to proceed independently; ➃ There were concerns about the US-China trade dispute.
  • December 31

  • TSMC develops silicon photonics tech to ease overheating in GPU
    ➀ TSMC has developed co-packaged optics (CPO) technology; ➁ The technology integrates a chiplet and an optical device; ➂ It aims to ease overheating in GPUs, particularly Nvidia’s GPUs.
  • December 29

  • Fabless LB Semicon aims to increase revenues from overseas
    ➀ LB Semicon, a South Korean outsourced semiconductor assembly and test (OSAT) firm, plans to significantly increase its revenue from overseas within the next three years; ➁ The company aims to achieve this by reducing its reliance on display driver ICs (DDIs); ➂ LB Semicon CEO Namseong Kim announced this during a press conference in Seoul.
  • December 20

  • SK Hynix wins large order for HBM from Broadcom
    ➀ SK Hynix has secured a significant order for HBM from Broadcom; ➁ The chips will be used in an AI computing chip for a major technology company; ➂ The deal is expected to enhance SK Hynix's market position in high-performance memory.
  • December 16

  • Park Systems’ AFM in high demand thanks to rise of hybrid bonding
    ➀ Park Systems' atomic force microscope (AFM) is in high demand among global chipmakers; ➁ The demand is driven by the necessity of the AFM for hybrid bonding processes; ➂ The company has already supplied test equipment to some chipmakers and is in discussions with others.
  • December 12

  • LB Semicon and LB Lusem to package power chips aimed at AI data centers
    ➀ LB Semicon and its subsidiary LB Lusem will provide turn-key packaging services for power management chips used in AI data centers. ➁ The services will include processing for both the front and back sides of wafers. ➂ They will also offer testing for the chips.
  • LB Semicon and LB Lusem to package power chips aimed at AI data centers
    ➀ LB Semicon and its subsidiary LB Lusem are set to provide turn-key packaging services for power management chips used in AI data centers. ➁ They will handle both the front and back sides of wafers. ➂ The announcement was made on Wednesday.
  • December 10

  • 3ALogics to launch a dozen of new NFC chips next year
    ➀ 3ALogics is planning to launch around ten new NFC-based wireless charging chips next year; ➁ The company has selected to focus on approximately 10 categories of NFC chips from over a hundred; ➂ CEO Park Kwang-beom emphasized the strategic choice for success.
  • 3ALogics to launch a dozen of new NFC chips next year
    ➀ 3ALogics, an NFC fabless chip company, plans to launch around ten new NFC-based wireless charging chips next year; ➁ The company's CEO, Park Kwang-beom, stated during a conference that they have selected to focus on approximately 10 categories of NFC chips to achieve success; ➂ The new chips are part of the company's strategy to expand its NFC chip offerings.
  • December 6

  • SK Hynix beefs up executive team amid high number of promotions
    ➀ SK Hynix has strengthened its executive team with a significant number of promotions at the end of the year; ➁ Executive Vice President Ahn Hyun has been promoted to President and also takes on the new role of Chief Development Officer (CDO); ➂ Ahn Hyun previously led SK Hynix’s N-S Committee, which was formed to enhance certain aspects of the company.
  • SK Hynix beefs up executive team amid high number of promotions
    ➀ SK Hynix has strengthened its executive team with a significant number of promotions at the end of the year. ➁ Executive Vice President Ahn Hyun has been promoted to President and also appointed as Chief Development Officer (CDO). ➂ Ahn previously led SK Hynix’s N-S Committee.
  • FOUP cleaner ISTE to also expand into PECVD
    ➀ FOUP cleaner ISTE is expanding into plasma-enhanced chemical vapor deposition (PECVD) equipment; ➁ Cho Chang-hyun, the CEO of the fab equipment manufacturer, announced this at the company's IPO conference; ➂ The PECVD equipment market is 30 times larger than that of FOUP.
  • FOUP cleaner ISTE to also expand into PECVD
    ➀ FOUP cleaner manufacturer ISTE is expanding into plasma-enhanced chemical vapor deposition (PECVD) equipment; ➁ The CEO of the fab equipment maker, Cho Chang-hyun, mentioned this during the company’s conference; ➂ The PECVD equipment market is 30 times larger than the FOUP market.
  • December 5

  • LB Semicon, DB Hitek to co-develop power chip
    ➀ LB Semicon and DB Hitek have announced a collaboration to co-develop an enhanced redistribution layer (RDL) for high-power chips; ➁ The RDL is a metal layer that connects the I/O pad within the chip to the outside world; ➂ This collaboration aims to improve the performance and connectivity of high-power chips.
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