1. TSMC's 3nm process technology is experiencing strong demand, with Apple as its primary customer for next-gen chips; 2. TSMC is expanding production capacity in Taiwan and exploring overseas plants to meet growing orders; 3. Competitors like Qualcomm and MediaTek plan to adopt the 3nm process, signaling robust industry momentum.

1. TSMC is seeking land in Pingtung, Taiwan, for a new CoWoS advanced packaging plant to meet the surging demand for AI chips. 2. The company's CoWoS production capacity is reportedly in serious short supply, prompting the expansion. 3. TSMC aims to more than double its CoWoS production capacity this year and continue efforts into 2025 to close the supply-demand gap.