10/22/2024, 07:39 AM UTC
ECOC2024：激光器封装器件ECOC2024: Lasers and Their Packaging Devices
<p>➀ 介绍基于硅光学的波长锁定芯片，强调其趋势、功能以及温度依赖性的挑战。</p><p>➁ 讨论基于硅光学的无源光隔离器，重点关注光学克尔效应和微环谐振器。</p><p>➂ 介绍一种可调谐的C+L波段激光器，特点为新型TOSA，具有超过100nm的调谐范围和高输出功率。</p><p>➀ Introduction of wavelength locking chips based on silicon photonics, highlighting their trend, functionality, and challenges with temperature dependence.</p><p>➁ Discussion on passive optical isolators based on silicon photonics, focusing on optical Kerr effect and micro-ring resonators.</p><p>➂ Presentation of a tunable C+L band laser, featuring a novel TOSA with over 100nm tuning range and high output power.</p>
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