03/03/2025, 09:28 AM UTC
STMicroelectronics将为数据中心和AI集群实现更高性能的云光互连STMicroelectronics To Enable Higher-Performance Cloud Optical Interconnect In Datacenters And AI Clusters
➀ STMicroelectronics宣布推出新的硅光子技术和下一代BiCMOS技术，旨在提升数据中心和AI集群中的光互连性能。
➁ 这些技术计划从2025年下半年开始生产，支持800Gb/s和1.6Tb/s的光模块，以应对AI驱动生态系统中对高速通信日益增长的需求。
➂ 与关键合作伙伴如AWS的合作有望推动硅光子和BiCMOS技术在光互连领域的创新和市场增长。
➀ STMicroelectronics has unveiled new silicon photonics and next-gen BiCMOS technologies aimed at enhancing optical interconnect performance in datacenters and AI clusters.
➁ These technologies, scheduled for production from H2 2025, will support 800Gb/s and 1.6Tb/s optical modules, addressing the growing demand for high-speed communication in AI-driven ecosystems.
➂ The collaboration with key partners like AWS is expected to drive innovation and market growth in silicon photonics and BiCMOS technologies for optical interconnects.
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