03/02/2025, 11:27 AM UTC
ST公司的12寸硅光平台ST's 12-inch Silicon Photonics Platform
<p>➀ ST微电子最近发布了其300mm硅光平台的新动态，梳理了其发展历程，供大家参考。</p><p>➁ ST于2012年开始与Luxtera合作，在Luxtera已有的硅光IP技术基础上开发12寸硅光平台。</p><p>➂ ST在2015年OFC展会上展示了其硅光平台进展，采用90nm工艺节点，具有特定的硅波导和光器件特性。</p><p>➃ Luxtera在ST平台上开发了PSM4和PSM8产品，但后来与TSMC合作，Luxtera的器件性能得到提升。</p><p>➄ ST最近宣布了新的硅光解决方案PIC100，器件性能显著提升，满足200G单通道应用需求。</p><p>➅ ST正在开发TSV和异质集成工艺，为400G/lane应用做准备。</p><p>➆ ST的新BiCMOS平台B55X旨在进军800G1.6T光模块市场，并已宣布与AWS合作。</p><p>➇ ST的硅光平台发展经历复杂，从与Luxtera的合作到现在的AWS合作。</p><p>➀ STMicroelectronics has recently released new developments in its300mm silicon photonics platform, detailing its development history for reference.</p><p>➁ ST began collaborating with Luxtera in 2012 to develop a 12-inch silicon photonics platform under Luxtera's existing silicon photonics IP technology.</p><p>➂ ST showcased its silicon photonics platform progress at OFC 2015, using a 90nm process node and specific characteristics of its silicon waveguides and optical devices.</p><p>➃ Luxtera developed PSM4 and PSM8 products on ST's silicon photonics platform, but later partnered with TSMC, leading to better performance for Luxtera's devices.</p><p>➄ ST recently announced a new silicon photonics solution, PIC100, with improved device performance to meet 200G single-channel application needs.</p><p>➅ ST is also developing TSV and heterogeneous integration processes for 400G/lane applications.</p><p>➆ ST is targeting the 800G and 1.6T optical module market with its new BiCMOS platform B55X, and has announced a partnership with AWS.</p><p>➇ ST's silicon photonics platform has had a complex development, from its partnership with Luxtera to its current collaboration with AWS.</p>
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