02/24/2025, 04:18 AM UTC
领先台积电一年？Intel 18A已经就绪！Intel 18A Ready to Take the Lead Over TSMC and Samsung
➀ 英特尔已正式上线对其最尖端的18A制程工艺的介绍，并称其已准备就绪；
➁ 预计18A制程将在2025年年中量产，由酷睿Ultra 300系列的Panther Lake处理器首发，预计今年下半年上市；
➂ 与Intel 3工艺节点相比，18A制程每瓦性能提升15%，芯片密度提升30%；
➃ 18A采用RibbonFET GAA晶体管技术，可实现电流精确控制，提高每瓦性能、最小电压操作和静电性能；
➄ 18A的PowerVia背面供电技术可将密度和单元利用率提高5%至10%，降低电阻供电下降，使ISO功率性能提高高达4%；
➅ 预计18A将在2025年下半年量产，可能比台积电的N2工艺领先近一年。
➀ Intel has officially launched the introduction of its most advanced 18A process technology and claims it is 'ready';
➁ The 18A process is expected to enter mass production in mid-2025, with the Panther Lake processor from the Core Ultra 300 series as the first to use it, which is expected to be launched in the second half of this year;
➂ Compared to the Intel 3 process node, the 18A process improves performance per watt by 15% and chip density by 30%;
➃ Intel 18A uses RibbonFET GAA transistor technology for precise current control and improved performance per watt, minimum voltage operation, and electrostatic performance;
➄ The PowerVia背面供电 technology of Intel 18A can improve density and utilization rate by 5% to 10% and reduce resistance power drop, thereby improving ISO power performance by up to 4%;
➅ Intel 18A is expected to enter mass production in the second half of 2025, potentially leading the industry by nearly a year over TSMC's N2 process.
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