02/24/2025, 11:56 AM UTC
英特尔18A工艺准备流片Intel 18A Process Ready for Tape-Out
➀ 英特尔宣布，其“四年五个节点”计划中的最后也是最为重要的英特尔18A工艺已准备就绪，计划于今年上半年开始流片；
➁ 18A工艺标志着英特尔IDM 2.0战略的重大突破，同时也被视为英特尔代工服务（IFS）重铸往日荣光的关键信号；
➂ 18A制程将引入多项半导体技术，相较于英特尔3nm制程，可将芯片密度提升30%，并提高每瓦性能约15%；
➃ 英特尔计划将18A制程应用于即将推出的Panther Lake笔记本电脑处理器与Clearwater Forest服务器CPU；
➄ 英特尔18A制程的两大突破是RibbonFET全环绕栅极晶体管和PowerVia背面供电技术；
➅ 通过RibbonFET晶体管，英特尔实现了全环绕栅极（GAA）架构，提供更精细的电流控制，降低功耗与漏电；
➆ PowerVia背面供电技术改变了芯片布线的逻辑，使晶体管的供电路径更加直接，提高了供电效率；
➇ 英特尔下一代移动处理器Panther Lake和桌面处理器Nova Lake将基于Intel 18A工艺制造 ，服务器CPU Clearwater Forest也计划于2026年上半年推出；
➈ 英特尔还将与外部芯片设计公司合作定制芯片，如亚马逊和微软。
➀ Intel has announced that its Intel 18A process, the final and most important in its 'four years, five nodes' plan, is ready for tape-out in the first half of this year;
➁ The 18A process represents a significant breakthrough for Intel's IDM 2.0 strategy and is seen as a key signal for the revitalization of Intel Foundry Services (IFS);
➂ The 18A process will introduce several advanced semiconductor technologies, with a 30% increase in chip density and a 15% improvement in performance per watt compared to Intel's 3nm process;
➃ Intel plans to apply the 18A process to the upcoming Panther Lake laptop processors and Clearwater Forest server CPUs;
➄ The ribbonFET full-gate transistor and PowerVia backside power supply technology are the two major breakthroughs of the 18A process;
➅ The ribbonFET transistor achieves a full-gate (GAA) architecture, providing finer control of current flow and reducing power consumption and leakage;
➆ PowerVia backside power supply technology changes the logic of chip wiring, making the power supply path for transistors more direct and improving power supply efficiency;
➇ Intel's next-generation mobile processor Panther Lake and desktop processor Nova Lake will be based on the Intel 18A process, with the server CPU Clearwater Forest also planned for release in the first half of 2026;
➈ Intel will also cooperate with external chip design companies to customize chips, such as Amazon and Microsoft.
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