09/22/2024, 08:56 AM UTC
英特尔衰落内幕：芯片之王如何走上颓废之路Inside Intel's Decline: How the 'Chip King' Strayed from Its Path
➀ 讨论了英特尔外包芯片制造和7nm CPU技术延迟的决定；➁ 分析了英特尔在14nm工艺技术停滞的原因，包括对晶体管密度的痴迷和对GAA FET制造工艺的追求；➂ 强调了英特尔设计部门面临的挑战，包括过高的野心和僵化的思维；➃ 探讨了台积电的参与和英特尔内部问题的影响；➄ 回顾了英特尔芯片制造过程的历史，突出了关键里程碑和挫折；➅ 讨论了技术制造组（TMG）在英特尔历史中的作用及其最近的重组；➆ 分析了英特尔在Tick-Tock模型中的挣扎及其对产品开发的影响；➇ 检查了英特尔内部的冲突和管理问题；➈ 考虑了英特尔的未来前景及其可能的恢复策略。➀ Intel's decision to outsource chip manufacturing and the delay in its 7nm CPU technology are discussed; ➁ The reasons behind Intel's stagnation in 14nm process technology are analyzed, including the obsession with transistor density and the pursuit of GAA FET manufacturing processes; ➂ The challenges faced by Intel's design department, including excessive ambition and rigid thinking, are highlighted; ➃ The impact of TSMC's involvement and the internal issues within Intel are explored; ➄ The history of Intel's chip manufacturing process is reviewed, highlighting key milestones and setbacks; ➅ The role of the Technology Manufacturing Group (TMG) in Intel's history and its recent restructuring is discussed; ➆ Intel's struggle with the Tick-Tock model and its impact on product development is analyzed; ➇ The internal conflicts and management issues within Intel are examined; ➈ The future prospects for Intel and its potential strategies for recovery are considered.
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