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June 15
- 伊頓的創新安全解決方案有助於加速電動汽車轉型1. Eaton, a smart power management company, showcased its comprehensive safety-focused electric vehicle (EV) technology at The Battery Show Europe. 2. The company's Breaktor® circuit protection technology integrates multiple safety functions into a single device, addressing the growing coordination challenges between fuses and contactors in high-power EV systems. 3. Eaton's three-in-one battery vent valve is the first of its kind, offering three unique functions to enhance battery safety and reliability.
- 伊顿的创新安全解决方案有助于加速电动汽车转型1. Eaton, a smart power management company, announced the display of its comprehensive suite of safety-focused electric vehicle (EV) technologies at The Battery Show Europe in Stuttgart, Germany. 2. The company's Breaktor® circuit protection technology integrates the functions of fuses, explosion-proof switches, and contactors into a single, coordinated, and resettable device, addressing the increasing coordination challenges between fuses and contactors in high-power EV systems. 3. Eaton's three-in-one battery vent valve is the first solution on the market with three unique functions, including passive and active ventilation and overpressure release for vehicle battery packs.
- indie Semiconductor Announces New Employee Inducement Grants1. indie Semiconductor, an Autotech solutions innovator, has granted equity awards known as Inducement Grants to new employees under its 2023 Inducement Incentive Plan. 2. The grants were approved by the Compensation Committee of the Board of Directors. 3. Details of the equity awards are available on the company's investor relations website.
June 14
- pSemi Joins the Connectivity Standards Alliance to Shape the Future of IoT (Internet of Things)1. pSemi, a company specializing in semiconductor solutions, has joined the Connectivity Standards Alliance. 2. This alliance is focused on developing and promoting standards for the Internet of Things (IoT). 3. pSemi's involvement aims to contribute to the advancement and standardization of IoT technologies.
- ASE Holdings Hosts Annual Supplier Day to Recognize Outstanding Suppliers of 20231. ASE Technology Holding Co., Ltd. hosted its annual Supplier Day to recognize and appreciate its suppliers. 2. Over 110 supplier representatives attended the event, which included subsidiaries ASE, SPIL, and USI. 3. The event highlighted the critical role of suppliers in the semiconductor assembly, test, materials, system design, and manufacturing sectors.
- StratEdge High-Performance Semiconductor Packages to be on Display at IMS 2024 Booth 5151. StratEdge will showcase its high-performance semiconductor packages at IMS 2024, Booth 515. 2. The packages are designed for high-frequency, high-power, and high-reliability applications. 3. The event will take place from June 18-20 in Washington, DC.
- Sensata Technologies Introduces the SGX Series Contactors for Material Handling, Energy Storage Systems, and DC Fast Charging Applications1. Sensata Technologies has introduced the SGX Series contactors designed for Material Handling, Energy Storage Systems, and DC Fast Charging Applications. 2. The launch was announced in Swindon, United Kingdom. 3. The SGX Series is expected to enhance efficiency and performance in various industrial applications.
- Accelsius to Present on the Impact of AI in Data Center Infrastructure at DIN London1. Accelsius, known for its patented two-phase, direct-to-chip liquid cooling systems, will be presenting at the DIN London event on June 18. 2. The presentation will focus on the impact of AI on data center infrastructure. 3. Dino Foderaro, Chief Revenue Officer of Accelsius, will be the speaker at this invitation-only event.
- nLIGHT and EOS Form Joint Strategic Cooperation to Usher in a New Era of Additive Manufacturing Laser Technology1. nLIGHT, a prominent provider of high-power semiconductor and fiber lasers, and EOS, a global leader in additive manufacturing technologies, have announced a strategic technology cooperation. 2. The partnership aims to integrate nLIGHT's beam shaping lasers into EOS' metal additive manufacturing systems. 3. This collaboration is expected to enhance the capabilities and efficiency of metal AM processes.
- AudienceXpress Announces Industry Veteran Scott Collins as Head of U.S. Commercial Sales and Operations1. AudienceXpress, a Comcast-owned ad buying platform, has appointed industry veteran Scott Collins as the Head of U.S. Commercial Sales and Operations. 2. Collins will manage all aspects of AudienceXpress' U.S. business, including advertising sales, revenue, business operations, and inventory optimization. 3. He will be based in New York and report to Katy Loria, U.S. CRO of FreeWheel.
- World Radiation-Hardened Chips Market Analysis 2023-2033 with BAE, Honeywell International, Advanced Micro Devices, Microchip Technology, and Texas Instrument Spearheading Innovation and Growth - ResearchAndMarkets.com1. The global radiation-hardened chips market is projected to grow from $1,278.0 million in 2023 to $3,283.8 million by 2033, with a CAGR of 9.90%. 2. Key players driving market growth include BAE Systems, Honeywell International, Advanced Micro Devices, Microchip Technology, and Texas Instruments. 3. The report provides a detailed analysis of market trends, applications, products, and regional dynamics over the next decade.
June 13
- Shin-Etsu Chemical: Entwicklung von Anlagen zur Herstellung von Halbleitergehäusesubstraten für den Back-End-Prozess und Verfolgung einer neuen Herstellungsmethode1. Shin-Etsu Chemical Co. Ltd. has developed a facility for manufacturing semiconductor package substrates using a new production method, which is subsequently used in the production of micro-LED manufacturing systems. 2. The facility is a high-performance processing plant that operates with an Excimer laser and employs the Dual-Damascene method.
- Samenvatting: Shin-Etsu Chemical: ontwikkeling van apparatuur om substraten voor halfgeleiderpacks te maken voor het backend-proces en toepassing van een nieuwe productiemethode1. Shin-Etsu Chemical Co., Ltd. has developed equipment for producing substrates for semiconductor packages using a new manufacturing method. 2. This development follows the production system for micro-LEDs. 3. The equipment features a high-performance processing system utilizing an excimer laser with a dual damascene structure.
- Resumen: DNP pone en marcha la línea de producción de máscaras metálicas para la fabricación de OLED en la planta de Kurosaki1. Dai Nippon Printing Co. Ltd. (DNP) has initiated a new production line for metallic masks used in OLED screen manufacturing at its Kurosaki plant in Kitakyushu, Fukuoka Prefecture, starting May 2024. 2. This expansion is in response to the increasing demand for larger OLED displays. 3. The new line will produce large-scale metallic masks compatible with 8th generation glass substrates.
- DNP nimmt Produktionslinie für Metallmasken zur Herstellung von OLEDs im Werk Kurosaki in Betrieb1. Dai Nippon Printing Co. Ltd. (DNP) has announced the launch of a new production line for metal masks used in the manufacturing of OLED displays at their Kurosaki plant in Kitakyushu City, Fukuoka Prefecture, starting May 2024. 2. This initiative is in response to the growing demand for larger OLED displays. 3. The new line will produce large-area metal masks compatible with 8th generation (G8) glass substrates for larger OLED panels.
- Samenvatting: DNP neemt OLED-productielijn voor metaalmaskers in gebruik in Kurosaki-fabriek1. Dai Nippon Printing Co., Ltd. (DNP) announced the upcoming launch of a new metal mask production line in May 2024. 2. The line will be located in the Kurosaki factory in Kitakyushu City, Fukuoka Prefecture, focusing on producing OLED screens. 3. This initiative aims to meet the growing demand for larger OLED displays.
- DNP黑崎工厂用于OLED制造的金属掩膜生产线开始运行1. Dai Nippon Printing (DNP) has launched a new metal mask production line at its Kurosaki plant in Kitakyushu, Fukuoka, to meet the growing demand for large OLED displays. 2. The new line is capable of producing large metal masks compatible with 8th generation (G8) glass substrates, which are significantly larger than the current 6th generation (G6) substrates, enhancing production efficiency. 3. The expansion is in response to the increasing adoption of OLED displays in various IT devices and the industry's shift towards larger, more efficient G8 substrates.
- Riassunto: DNP avvia la linea di produzione di maschere metalliche per la fabbricazione di display OLED nello stabilimento di Kurosaki1. Dai Nippon Printing Co., Ltd. (DNP) has initiated a new production line for metal masks used in manufacturing OLED displays at its Kurosaki facility in Kitakyushu, Fukuoka Prefecture, scheduled to start in May 2024. 2. This expansion aims to meet the growing demand for larger OLED displays. 3. The new line will produce large-scale metal masks compatible with large glass substrates.
- Shin-Etsu Chemical：開發用於後端製程的半導體封裝基板製造設備並尋求新的製造方法1. Shin-Etsu Chemical has developed a new equipment for manufacturing semiconductor packaging substrates using a high-performance processing device with excimer laser, applying the dual damascene method from front-end semiconductor manufacturing to back-end processes. 2. This method integrates the interposer function directly into the packaging substrate, eliminating the need for interposers and enabling finer processing not possible with traditional methods. 3. The approach also reduces costs and capital investment by eliminating the photoresist process in the packaging substrate manufacturing process.
June 12
- Shin-Etsu Chemical: Developing Equipment to Manufacture Semiconductor Package Substrates for the Back End Process and Pursuing a New Manufacturing Method1. Shin-Etsu Chemical has developed new equipment for manufacturing semiconductor package substrates, following their micro-LED manufacturing system. 2. The equipment utilizes an excimer laser and employs a dual damascene method, similar to that used in the front end of semiconductor manufacturing. 3. This development aims to enhance the back end process of semiconductor manufacturing.
- DNP commence l'exploitation de la chaîne de production de masques métalliques pour la fabrication d'écrans OLED à l'usine de Kurosaki1. Dai Nippon Printing Co., Ltd. (DNP) has started operating a new production line for metal masks used in the manufacturing of OLED screens at its Kurosaki plant in Kitakyushu, Fukuoka Prefecture, in May 2024. 2. This new production line aims to meet the growing demand for larger format OLED screens. 3. The metal masks produced will be crucial for the production of OLED displays.
- DNP Commences Operation of Metal Mask Production Line for OLED Manufacturing at Kurosaki Plant1. DNP has started operating a new metal mask production line dedicated to OLED display manufacturing at its Kurosaki Plant. 2. This development marks a significant step in enhancing the production capabilities for OLED technology. 3. The new line is expected to support the growing demand for OLED displays in various industries.
June 11
- CAMBRIDGE GaN DEVICES 新型ICeGaN GaN功率IC使資料中心、逆變器和工業開關電源實現最高效率1. Cambridge GaN Devices (CGD) has introduced the ICeGaN™ GaN power IC, designed for high-efficiency applications in data centers, inverters, and industrial power supplies. 2. The new ICeGaN™ P2 series features a low RDS(on) of 25 mΩ, supporting multi-kW power applications. 3. CGD's Chief Commercial Officer, Andrea Bricconi, highlighted the growing demand for GaN solutions in data centers due to the increasing energy consumption from AI growth.
June 10
- Mitsubishi Electric Ships Two New SBD-embedded SiC-MOSFET Modules1. Mitsubishi Electric Corporation has started shipping two new versions of its SBD-embedded SiC-MOSFET modules, a 3.3kV/400A and a 3.3kV/200A, for use in large industrial equipment. 2. These modules are part of the newly named UnifullTM series, which also includes a 3.3kV/800A version. 3. The modules are designed for applications in rolling stock and electric power systems.
June 7
- Europe Quantum Processors Industry Research 2024: Photonics, The Next Big Quantum Computing Technology - Analysis and Forecasts 2023-2033 - ResearchAndMarkets.com1. The report focuses on the Europe quantum processors market, valued at $262.7 million in 2023 and projected to reach $1,321.1 million by 2033. 2. The market is expected to grow at a CAGR of 17.53% due to advancements in quantum computing technology. 3. The study covers various aspects including application, type, business model, and country-wise analysis.
- Kontron Introduces the VX60961. Kontron, a global leader in IoT/Embedded Computer Technology, has launched the VX6096, a 6U VPX Plug-in Card. 2. The card features Intel Xeon D2700/2800 processors and utilizes advanced Air Flow Through cooling technology (VITA48.8). 3. With high processing power and superior hardware security features, the VX6096 is designed for compute-intensive applications in military radar segments, including airborne.
- Semtech Appoints Semiconductor Industry Leader, Hong Q. Hou, as President and CEO1. Semtech Corporation announced the appointment of Dr. Hong Q. Hou as President and CEO, effective June 6, 2024. 2. Dr. Hou, currently a member of the Semtech Board of Directors, succeeds Paul H. Pickle. 3. The appointment reflects Semtech's strategic direction and leadership transition.
- Global Semiconductor Rectifier Market to Reach US$ 8.0 Billion by 2032: Growth Driven by Advanced Applications in Consumer Electronics and Automotive Industries - ResearchAndMarkets.com1. The global semiconductor rectifier market is projected to grow from $4.7 billion in 2023 to $8.0 billion by 2032. 2. This growth is driven by advanced applications in consumer electronics and automotive industries. 3. The market is expected to achieve a CAGR of 6.09% during this period.
- Riassunto: La campagna di Sisvel semplifica i brevetti per i produttori di dispositivi cellulari IoT1、西斯维尔推出新宣传活动，帮助IoT设备制造商理解NB-IoT和LTE-M标准的法律问题。 2、新宣传活动在iotpatentpool.com上提供简单高效的解决方案。 3、西斯维尔的专利池旨在确保Cellular IoT技术的持续发展。
- CAMBRIDGE GAN DEVICES 為電機控制帶來 GAN 優勢1、剑桥GAN设备（CGD）是一家无晶圆厂洁净技术半导体公司，致力于开发多种节能的氮化镓（GaN）器件。 2、CGD正与全球领先的连接和电源解决方案供应商Qorvo合作开发GaN在电机控制应用中的参考设计和评估套件（EVK）。 3、CGD旨在加快GaN功率IC在无刷直流电机（BLDC）和永磁同步电机（PMSM）应用中的使用，打造更高功率、高效、紧凑和可靠的系统。