businesswire
Author page description
June 26
- Riassunto: GlobalPlatform offre un quadro di riferimento per la sicurezza per il lancio dello storico ecosistema per il portafoglio dell'identità digitale europea1. GlobalPlatform is providing a security framework to support the scalable European Digital Identity Wallet (EUDI). 2. The initiative aims to help EU member states and smartphone vendors implement the eID Wallet scheme smoothly across Europe. 3. This move is intended to promote widespread adoption of digital identity wallets.
- Resumen: GlobalPlatform proporciona un entorno de seguridad para lanzar un ecosistema digital de monederos electrónicos en Europa1. GlobalPlatform is enhancing its efforts to support the scalable European Digital Identity Wallet (EUDI) ecosystem in Europe. 2. The initiative aims to facilitate smooth implementation of the digital identity wallet system across EU member states and among smartphone providers. 3. This move is part of broader efforts to establish a secure digital wallet environment in Europe.
- Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity1. Cadence has expanded its system IP portfolio with the introduction of the Cadence Janus Network-on-Chip (NoC). 2. The new NoC aims to optimize electronic system connectivity. 3. This expansion is expected to improve performance, power, and area (PPA) faster and with lower risk.
- Samenvatting: GlobalPlatform biedt beveiligingskader om eID Wallet, het digitale ecosysteem dat als Europa's grote keerpunt geldt, te lanceren1. GlobalPlatform is enhancing its efforts to support the scalable European Digital Identity (EUDI) Wallet. 2. The organization is introducing new solutions to assist EU member states and smartphone suppliers in seamlessly implementing the eID Wallet across Europe. 3. GlobalPlatform plans to convene stakeholders to further develop the initiative.
- Pickering Interfaces Expands Upon the Industry’s Largest Portfolio of PXI Digital I/O Modules1. Pickering Interfaces has introduced four new families of industrial digital I/O modules for PXI and LXI-based systems. 2. These new additions offer increased density, wider voltage and current ranges, and programmable logic levels. 3. The modules are available in both PXI and PXIe form factors, enhancing the company's portfolio in electronic test and verification.
- Advanced Energy’s New Impedance Matching Network Provides Ultra-Fast, RF-Synchronized Tuning to Multilevel Pulse States1. Advanced Energy Industries has introduced the NavX™ impedance matching network, featuring advanced algorithms and direct generator communication. 2. This technology enables ultra-fast, RF-synchronized tuning to multilevel pulse states, enhancing plasma control precision. 3. The network is crucial for next-generation semiconductor etch processes in the 'Angstrom-Era' fabrication.
- Keysight Streamlines and Automates Samsung Semiconductor India Research’s 5G Field-to-Lab Workflow1. Keysight Technologies announced that Samsung Semiconductor India Research has adopted the Keysight Signaling Field-To-Lab solution for its 5G workflow. 2. The solution aims to streamline and automate the field-to-lab process in SSIR's Bengaluru lab. 3. This end-to-end 5G wireless protocol signaling solution enhances end-user quality of experience by facilitating the replication and resolution of field issues in a lab setting.
- SiFive Announces 4th Generation of Popular Essential Product Line to Spur Innovation Across Embedded Applications1. SiFive, a leader in RISC-V computing, has announced the fourth generation of its popular Essential product line at the RISC-V Summit Europe 2024. 2. The Essential IP, developed over a decade, is already utilized in billions of products across various sectors including mobile phones, sensors, and smartwatches. 3. This update introduces enhanced performance, improved power efficiency, and more flexible interfaces to further spur innovation in embedded applications.
June 25
- China Hi-Tech Fair Gearing up for Its 26th Edition on November 14 in Shenzhen1. The 26th China Hi-Tech Fair is scheduled to take place from November 14 to 16, 2024 in Shenzhen. 2. The event will be themed around 'Technology Leads Development, Industry Integrates Fusion'. 3. This fair serves as a significant platform for showcasing technological advancements and fostering industrial integration.
- Riassunto: China Hi-Tech Fair si prepara per la sua 26a edizione il 14 novembre a Shenzhen1. The 26th China Hi-Tech Fair (CHTF) is set to commence on November 14, 2024, in Shenzhen. 2. This prestigious international technology event will be held at the Shenzhen World Exhibition & Convention Center. 3. The theme for this edition is 'Technology Leads Development, Industry Integrates Fusion', showcasing the latest in technology and products.
- Le China Hi-Tech Fair se prépare à sa 26e édition le 14 novembre à Shenzhen1. The 26th China Hi-Tech Fair (CHTF) is scheduled to take place from November 14 to 16, 2024, in Shenzhen. 2. The event, themed 'Technology Leads Development, Industry Integrates Fusion', will be held at the Shenzhen World Exhibition & Convention Center. 3. With an exhibition space of 400,000 square meters, CHTF 2024 is expected to attract a significant number of participants showcasing innovative technologies and products.
- China Hi-Tech Fair se prepara para sua 26ª edição em 14 de novembro em ShenzhenThe 26th China Hi-Tech Fair (CHTF) is scheduled to take place from November 14 to 16, 2024, at the Shenzhen World Exhibition & Convention Center. With the theme 'Technology Drives Development, Industry Integrates Fusion,' the event will cover an exhibition area of 400,000 square meters and is expected to attract over 5,000 exhibitors and 500,000 participants from around the world.
- La Feria de Alta Tecnología de China prepara su 26.ª edición para el 14 de noviembre en Shenzhen1. The 26th China Hi-Tech Fair (CHTF) is scheduled to take place from November 14 to 16, 2024, in Shenzhen. 2. The event will be held at the Shenzhen World Exhibition & Convention Center. 3. With a theme of 'Technology Leads Development, Industry Integrates Fusion', the fair will cover an exhibition area of 400,000 square meters.
- China Hi-Tech Fair bereitet sich auf ihre 26. Ausgabe am 14. November in Shenzhen vorThe China Hi-Tech Fair (CHTF), a leading international technology event, is set to hold its 26th edition from November 14 to 16, 2024, at the Shenzhen World Exhibition & Convention Center. Under the theme 'Technology Leads Development, Industry Integrates Fusion,' the fair will feature over 5,000 exhibitors and attract around 500,000 visitors across a 400,000 m² exhibition area.
- Samenvatting: China Hi-Tech Fair maakt zich klaar voor de 26e editie die op 14 november in Shenzhen van start gaat1. The 26th China Hi-Tech Fair (CHTF) is set to commence on November 14, 2024, in Shenzhen. 2. The event will be held at the Shenzhen World Exhibition & Convention Center under the theme 'Technology Leads Development, Industry Integrates Fusion'. 3. CHTF 2024 is expected to host over 5,000 exhibitors and cover an exhibition space of 400,000 square meters.
- 第26届高交会将于11月14日在深圳盛大开幕The 26th China Hi-Tech Fair (CHTF) is set to open on November 14, 2024, in Shenzhen. This event, themed 'Technology Leading Development, Industry Integration and Transformation', is the largest international technology exhibition in China, showcasing cutting-edge innovations and products globally. With an exhibition area of 400,000 square meters, it is expected to host over 5,000 high-tech companies from more than 100 countries and regions, attracting 500,000 professional visitors. The fair will highlight 20 rapidly growing industries and feature around 150 concurrent events.
- 第26屆高交會將於11月14日在深圳盛大開幕The 26th China Hi-Tech Fair (CHTF) is set to open on November 14, 2024, in Shenzhen, showcasing the latest innovations and technologies. With a theme of 'Technology Leading Development, Industry Convergence Fission,' the event will feature over 5,000 exhibitors from around the globe and an expected 500,000 professional visitors. The fair will highlight 20 rapidly growing industries and host around 150 side events, reinforcing Shenzhen's status as an international innovation hub.
June 22
- Tenstorrent Licenses Baya Systems’ Fabric into Next-Generation AI and Compute Chiplet Solutions1. Tenstorrent has licensed Baya Systems' fabric technology for its next-generation AI and compute chiplet solutions. 2. This collaboration aims to enhance the interconnectivity and performance of AI and compute chips. 3. The partnership is expected to drive advancements in AI hardware.
- IonQ Promotes Dr. Dean Kassmann to Senior Vice President of Engineering and Technology1. IonQ, a leader in quantum computing, has promoted Dr. Dean Kassmann to Senior Vice President of Engineering and Technology. 2. This follows Dr. Kassmann's role as Vice President of Engineering, where he significantly contributed to the company's growth and innovation. 3. The promotion acknowledges Dr. Kassmann's leadership and impact over the past two and a half years.
June 21
- Baya Systems Introduces New Technology to Transform and Accelerate Intelligent Computing1. Baya Systems has introduced a new technology aimed at transforming and accelerating intelligent computing. 2. The announcement was made in Santa Clara, California. 3. This development is expected to enhance the capabilities of intelligent computing systems.
- GRF Sampling Highest Performing Broadband Gain Block to Date, Stretching Performance of Its Leading Amp Core to 11 GHz1. GRF is currently sampling its highest performing broadband gain block to date. 2. The performance of its leading amplifier core has been extended to operate at 11 GHz. 3. This development marks a significant advancement in the company's product capabilities.
- TD SYNNEX Announces Patrick Zammit to Become CEO1. TD SYNNEX has announced that Patrick Zammit will take over as the new CEO, replacing Rich Hume who is set to retire. 2. Rich Hume's tenure as CEO has been marked by significant transformation within the company. 3. The leadership change is expected to continue the strategic direction of TD SYNNEX.
- Onto Innovation Invites Customers and Investors to Schedule Meetings at SEMICON® West1. Onto Innovation Inc. announced its participation in SEMICON West on July 9-11, 2024. 2. The company invites customers to booth 633 to explore its latest integrated process and process control solutions. 3. Onto Innovation will showcase technologies supporting advanced packaging and next-generation AI and chiplet lithography.
- Renesas’ R-Car Open Access Platform Accelerates Software-Defined Vehicle Development With Market-Ready Software1. Renesas has introduced the R-Car Open Access development platform specifically designed for software-defined vehicles. 2. This platform aims to accelerate the development of SDVs by providing market-ready software solutions. 3. The launch was announced in Tokyo with the intention to support the growing demand for software-centric automotive solutions.
- Mobix Labs Collaborates to Develop Low-Cost, Energy-Efficient 5G Base Station Solutions1. Mobix Labs Inc. has announced a strategic partnership with TalkingHeads Wireless to develop cost-effective and energy-efficient 5G base stations. 2. THW's 5G radio solution incorporates AI technology to optimize energy consumption in towers. 3. Mobix Labs contributes with a range of products including ICs, antennas, and active optical cables and transceivers.
- InnoPhase IoT Unveils Talaria TWO Matter v1.2 Certified Wi-Fi Solution1. InnoPhase IoT, a company focused on ultra-low power Wi-Fi IoT solutions, has released the Talaria TWO Matter v1.2 certified Wi-Fi solution. 2. The solution is based on a single-chip SoC, differentiating from the multiple-chip approach used by many competitors. 3. The Matter protocol used in this solution ensures vendor-independent device compatibility, simplifying setup and operation.
June 20
- UMC Launches Most Advanced 22nm eHV Platform to Power Next-Generation Smartphone Displays1. UMC has launched its 22nm embedded high voltage (eHV) technology platform, which is the most advanced in the market for display driver ICs. 2. The platform is designed to power premium displays for smartphones and other mobile devices. 3. The 22eHV platform offers improved power efficiency and reduced die size, enabling manufacturers to enhance their products.
June 18
- Comtech to Report Third Quarter Fiscal 2024 Results and Announces New $222.0 Million Credit Facility1. Comtech plans to release its third quarter fiscal 2024 results on June 18, 2024. 2. The Company will announce a new $222.0 million credit facility. 3. A conference call will be held by John Ratigan and Michael Bondi to discuss the financial results and business trends.
June 15
- Fabrinet Appoints Forbes Alexander to Board of Directors1. Fabrinet, a provider of advanced optical packaging and manufacturing services, has appointed Forbes Alexander to its Board of Directors. 2. This appointment expands the Board to eight members. 3. Forbes Alexander will also join the Board's Audit Committee, bringing extensive leadership experience.
- Fiber Broadband Association Announces Fiber Forward 2024 AMPLIFY Award Finalists1. The Fiber Broadband Association (FBA) has announced the finalists for the 2024 Fiber Forward AMPLIFY Awards. 2. These awards honor individuals, companies, and innovations that enhance the fiber broadband industry. 3. The award recipients will be revealed at the Fiber Connect 2024 event in Nashville on July 28.
Page 1 of 3 pagesNext