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April 1
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➀ New Heng Hui Electronic Co., Ltd. (New Heng Hui) has been granted the approval for its initial public offering by the China Securities Regulatory Commission, with the company expected to be listed on the A-share market soon.
➁ New Heng Hui is the leading enterprise in the field of intelligent card packaging materials globally, focusing on intelligent card packaging materials and packaging and testing services. Its core product, flexible lead frame, is a key material for intelligent card chip packaging, directly affecting the cost and performance of intelligent card modules.
➂ Yu Renrong, the controlling shareholder of Shanghai Weil股份 and the largest shareholder of New Heng Hui, acquired New Heng Hui in 2018. New Heng Hui has been listed on the Shanghai Stock Exchange on March 22, 2023.
行家说三代半
➀ Infineon and Innosilicon have announced a strategic collaboration for 8-inch GaN wafer manufacturing, potentially reshaping the power semiconductor industry.
➁ The partnership aims to enhance GaN power solution performance and supply chain resilience, with a focus on widespread application in consumer electronics, data centers, automotive, and industrial power systems.
➂ The collaboration will leverage the manufacturing capacities of both companies, with Innosilicon using Infineon's overseas and vice versa, to expand the GaN product portfolio and market supply capabilities.