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  • Bestech Micro Revenue Soars, Losses for Two Years, R&D Investment as 'Culprit'?

    微信公众号

    ➀ Bestech Micro's 2024 revenue reached 6.88 billion yuan, a year-on-year increase of 18.98%;

    ➁ Non-GAAP net profit was -46.28 million yuan, and the company's profitability was poor due to a decline in operating income;

    ➂ The main reasons for the company's continuous losses despite increased revenue are intense market competition and insufficient R&D investment.

  • March 17

  • Exclusive: Huawei Noah's Ark Lab Director姚骏 Succeeded by Youngest Leader Wang Yunhe

    AI 科技评论

    ➀ Huawei Noah's Ark Lab undergoes leadership change with new director, Wang Yunhe, a 90-year-old successor to Yao Jun;

    ➁ Yao Jun, the former director, has an extensive background in AI research, including deep learning and AI hetero-systems;

    ➂ Wang Yunhe has a strong academic and professional background in AI, including deep learning, model compression, and computer vision, and has been involved in significant projects at Huawei.

  • Changan-SIDA SiC Project Set to Begin Production with 1.8 Million Units

    Unknown

    ➀ The Changan-SIDA SiC project, a joint venture between Changan's Deep Blue Auto and SIDA Semiconductor, is set to begin production with an initial capacity of 1.8 units.

    ➁ The project is expected to reach full production in June, with a first-phase capacity of 500,000 units and a second-phase capacity of 1.8 million units.

    ➂ SIDA Semiconductor, founded in 2005, specializes in the design, research, production, and sales of IGBT and SiC power semiconductor chips and modules.

  • Sudden Acquisition! Huada Jiutian 'Surprises' Chip and Semiconductor!

    微信公众号

    ➀ Huada Jiutian plans to acquire the controlling stake of Chip and Semiconductor through the issuance of shares and cash payment.

    ➁ Huada Jiutian is committed to becoming a leading EDA provider in the global market.

    ➂ Chip and Semiconductor aims to create a full-stack EDA platform for the AI era, covering chip, packaging, module, PCB board-level, interconnection, and整机 system.

  • March 16

  • An Overview of ADC

    Unknown

    ➀ Briefly introduces ADC (Analog to Digital Converter) and its basic functions;

    ➁ Discusses the author's personal experience with SAR ADC and the importance of engineering experience over theory;

    ➂ Explains the three main steps of ADC: sampling, quantization, and coding;

    ➃ Describes various ADC specifications and classifications, including static and dynamic parameters, and different types of ADC structures such as full-flash, two-step, pipeline, integrating, successive approximation, and sigma-delta ADCs.

  • He, 65, Takes the Reins of the 'King of Chips'

    融中财经

    ➀ Chen Liwu, 65, has been appointed as the new CEO of Intel, marking the first time in Intel's 57-year history that a Chinese has held the position.

    ➁ Chen is known as the 'Father of Chip Venture Capital' and has founded Walden International, managing over $3 billion in capital and investing in over 500 companies, including many semiconductor companies.

    ➂ Intel has faced challenges such as declining revenue and market share loss in recent years, prompting the appointment of Chen to lead a strategic shift.

  • The Legend of Futures Enters Chip Industry: From Secondary to Primary Market, Chip Market风云际会

    Unknown

    ➀ The legendary futures trader Guo Yanchao enters the chip industry, investing in Beijing Chenzhi Semiconductor Technology Co., Ltd., and stirring up the chip market.

    ➁ The shift to centralized architecture in automotive electronics is challenging the current landscape, with domestic players struggling to replace imported central domain controller chips.

    ➂ Chenzhi Semiconductor, with its high-level ASIL-D automotive chips and experienced team, aims to compete with international giants and become a key player in the domestic substitution of chips.

  • The Intensifying Competition in the MCU Industry

    icbank

    ➀ The competition in the MCU field is heating up, with Infineon becoming the largest supplier in 2024 with a market share of 21.3%;

    ➁ At the Embedded World 2025 in Nuremberg, Germany, major MCU manufacturers are competing in areas such as size, power consumption, storage technology, AI computing power, advanced processes, and architecture innovation (especially RISC-V);

    ➂ The article discusses the five dimensions of the 'fight' in the MCU industry: size and power consumption, process technology, storage technology, AI and computing power, and architecture.

  • Huawei Launches Heavyweight CPU Chip Product to Compete with Intel

    IT之家、小8说科技

    ➀ Huawei's Hisilicon Kirin X90 processor has obtained a security reliability grade of II, indicating its excellence in security, stability, and reliability.

    ➁ The processor is expected to be released in the second half of 2025, possibly with new Huawei PC or server products.

    ➂ The Kirin X90 is positioned to focus on commercial ecosystem compatibility and AI computing capabilities, potentially expanding to high-end tablets and convertible devices.

  • March 14

  • A Multi-Billion Yuan Chip Merger Falls Through

    微信公众号

    ➀ A multi-billion yuan chip merger between Huizheng Technology and Yunying Valley was terminated due to price disagreements.

    ➁ Yunying Valley, founded by a Harvard graduate, has been focused on semiconductor display chip design and has attracted numerous investors.

    ➂ The merger failure highlights the challenges in the exit strategy for startups in the semiconductor industry, with many seeking IPOs as an alternative.

  • March 13

  • TI全球最小MCU:国产芯片积极应战

    微信公众号

    ➀ TI's smallest MCU has been widely discussed recently, prompting the author to mention some competitive domestic chip products.

    ➁ The CH32V005D6U6 MCU is smaller than TI's in terms of volume but offers double the Flash capacity and six times the RAM. It also includes an additional built-in operational amplifier and more GPIO pins, and saves a pin for single-wire debugging.

    ➂ CH634F is the smallest USB3.0 HUB chip with a 4*4mm QFN32 package, featuring two 3.0 ports and four 2.0 ports.

    ➃ CH634M is the smallest 4-port USB3.2 Gen1 HUB chip, supporting 100W PD fast charging, and is designed with a 5*5mm QFN48 package.

    ➄ CH32M007 is a 1 yuan-priced MCU with built-in high-voltage LDO and three-phase motor pre-driver and op-amp, in a 3*3mm QFN26 package.

    ➅ CH585 is a Bluetooth chip with a 3*3mm QFN20 package, integrating 480Mbps high-speed USB and NFC.

    ➆ CH390D is the smallest Ethernet controller with a 3*3mm QFN20 package, and CH395F is the smallest Ethernet protocol stack chip with a 4*4mm QFN32 package.

    ➇ CH132C is a USB2.0 PHY chip in a 2*2mm QFN package, and CH182D is a gigabit Ethernet PHY chip in a 3*3mm QFN package.

  • March 11

  • McGill&Intel Collaborate on Coherent Technology for High-Speed Data Centers and Next-Generation PON

    Unknown

    ➀ McGill and Intel demonstrate the application of coherent technology in high-speed data centers and next-generation PON using heterogeneous integration technology.

    ➁ They achieve a 400 Gbps/λ O-band SiP coherent optical link and a 200-G DS coherent PON for ONU, compatible with 25~200 Gbps.

    ➂ The proposed solution supports high-volume production and is energy-efficient.

  • March 7

  • Passive Component Market Recovery and Price Pressure Relief: Growth in Orders for Kemet, Murata, and TDK

    Unknown

    ➀ The electronic consumer demand has seen a recovery after several quarters of adjustment, leading to a resurgence in the passive component market.

    ➁ Kemet's operations manager Wang Danru noted that the market for multilayer ceramic capacitors (MLCC) has shown signs of recovery and price pressure has eased.

    ➂ Murata Manufacturing Co. and TDK Corporation, two major Japanese passive component manufacturers, have also seen an increase in orders.

  • Sandisk Announces Price Increase: All Products to Rise Over 10% Starting April 1!

    XinZhiXun (Smart News)

    ➀ Sandisk plans to increase prices for all products aimed at channel and consumer customers starting April 1, with a hike of over 10%.

    ➁ The increase is due to the transition to a supply shortage in the NAND Flash chip industry and recent tariff changes, which will affect the availability of supplies and increase Sandisk's business costs.

    ➂ Sandisk will continue to conduct frequent price reviews and expects additional increases in the next quarter.

  • March 6

  • ASML China Revenue Share at 36.1%, to Build New Service Center in Beijing This Year!

    XinZhiXun (Chips Intelligence)

    ➀ ASML's annual revenue reached €28.263 billion in 2024, with China contributing 36.1% of the total.

    ➁ ASML plans to open a new service center in Beijing, China, to enhance its repair capabilities.

    ➂ The company expects the semiconductor market to recover, driven by demand for AI-related memory and advanced logic chips.

  • ADI Cancels Wenye Agency!

    International Electronics News

    ➀ ADI has confirmed the cancellation of Wenye's agency rights without issuing a formal press release, representing a business change in channel integration.

    ➁ Wenye has actively issued a statement, indicating that the last delivery date for ADI products to the company is July 26, 2025. ADI also requires the company to send all purchase orders to ADI by the end of April to ensure a smooth supply of ADI products during the transition period of the agency business.

    ➂ Currently, ADI has only two authorized agents in mainland China: Zhongdiangang and Junlong.

  • Major News: Liu De-yin Joins Micron as Director!

    芯榜

    ➀ Liu De-yin has joined Micron Technology's board of directors, bringing his extensive experience in the semiconductor industry to the company.

    ➁ Liu's impressive career at TSMC, where he rose to the position of chairman, has provided him with a wealth of experience in management and technology.

    ➂ Micron expects Liu's expertise to help the company expand its business and capitalize on growth opportunities in the semiconductor industry, particularly in the areas of data centers and edge computing.

  • March 5

  • 仿真案例大全:从硅功率器件到光电相关

    微信公众号名称或转载的出处

    ➀ This resource covers a wide range of simulation cases, including silicon power devices, wide-bandgap devices, BJT devices, CMOS/Logic devices, ESD devices, memory devices, nanoscale devices, two-dimensional materials, thin-film transistors, photonic devices, and more.

    ➁ It discusses the importance of accessing high-quality technical resources and learning materials in the fast-paced information age.

    ➂ The article emphasizes the need for targeted textbooks, online courses, interactive learning platforms, and an active user community to facilitate the learning of professional software and simulation programming.

  • CoreWeave, the AI Computing Power Giant Backed by NVIDIA, Aims for IPO with a Valuation of Up to 254 Billion RMB

    ZhiDongXi (智东西)

    ➀ CoreWeave, an AI cloud service provider backed by NVIDIA, has filed for an IPO on the NASDAQ, seeking a valuation of up to 254 billion RMB.

    ➁ CoreWeave, founded in 2017, has shifted from cryptocurrency mining to selling GPU resources to enterprises after the cryptocurrency crash in 2018.

    ➃ The company's annual revenue surged by 730% in 2024, reaching 19.15 billion USD, but its annual loss also reached 863 million USD due to heavy investment in AI infrastructure.

  • Shanghai Chip Industry: Another Major Asset Restructuring!

    微信公众号

    ➀ Shanghai's Xinxiangwei Microelectronics Co., Ltd. plans to purchase the controlling rights of Shenzhen Aoxiesheng Technology Co., Ltd. through issuing shares and paying cash;

    ➁ Xinxiangwei is a leading domestic display chip supplier and has established good cooperative relations with major panel manufacturers and display module manufacturers;

    ➂ The acquisition is part of Xinxiangwei's strategy to expand its business through external growth, following its establishment of a new display industry acquisition fund.

  • Analog Devices Considers Acquisition of Car Chip Manufacturer, Valued at 4.1B!

    Not provided

    ➀ Analog Devices is considering the acquisition of smaller chip manufacturer Allegro Microsystems, which primarily produces sensor integrated circuits.

    ➁ Allegro has not yet decided to sell the entire company, and Analog Devices has been discussing the feasibility of the acquisition with advisors in recent months, with other also showing interest.

    ➂ Allegro is currently valued at $4.11 billion, while Analog Devices is valued at $19.83 billion.

  • Trump Calls for Abolition of U.S. Chip Bill

    芯榜

    ➀ U.S. President Trump stated in a joint session of Congress on March 4 that the U.S. should abolish the chip bill.

    ➁ Sources indicate that approximately one-third of the staff in the U.S. Commerce Department's office responsible for regulating $39 billion in manufacturing subsidies for chip manufacturers were laid off this week.

    ➂ Around 40 employees on probation were dismissed on March 3, receiving emails about their termination around 2 p.m. Eastern Time and leaving the company at 4 p.m.

  • Zhongxin Heavy Industry Chairman Wu Hanqi: Promoting Integrated Coordination of 'Chip + Operating System + Application'

    Unknown

    ➀ Wu Hanqi, Chairman of Zhongxin Heavy Industry, proposes suggestions to accelerate the development of domestic industrial operating systems and promote the nationalization of high-end industrial controllers.

    ➁ Wu suggests strengthening top-level design, forward-looking layout, and independent research and development of high-end industrial operating systems, with support for key enterprises including financial investment, tax incentives, national research and development projects, government procurement preferences, and encouraging the use of domestic chips and operating systems.

    ➂ Wu also indicates that through policy guidance, promote the application of domestic industrial operating systems in various scenarios such as mining, building materials, coal, metallurgy, new energy, and robotics, and encourage domestic chip and hardware manufacturers to prioritize compatibility with domestic operating systems.

  • The Charm of RISC-V Chips: Why They Are Encouraged for National Adoption Across China

    芯智讯

    ➀ China plans to release guidelines encouraging the national use of RISC-V-based chips, according to a Reuters report.

    ➁ The RISC-V architecture is attractive due to its openness, allowing anyone to freely obtain, learn, modify, and extend it.

    ➂ RISC-V has been embraced by global companies like Alibaba, Qualcomm, and NVIDIA, contributing to its rapid development.

  • Vietnam to Build Its First Wafer Factory

    半导体行业观察

    ➀ Vietnam's government has approved a $500 million wafer factory construction plan, marking the country's first such facility.

    ➁ The project aims to support defense, high-tech industries, and research needs, with potential funding of up to $500 million.

    ➂ Vietnam has offered tax incentives, allowing chip companies to retain 20% of income for reinvestment into the local semiconductor ecosystem.

    ➃ Vietnam has been attracting foreign investment in the semiconductor industry, with major companies like Intel and Amkor already established in the country.

    ➄ The government plans to build six wafer factories by 2030, aiming to make Vietnam a global semiconductor hub.

  • March 4

  • Marvell Unveils 2nm Chip, Targeting NVIDIA

    半导体行业观察

    ➀ Marvell showcased its first 2nm silicon wafer IP designed for next-generation AI and cloud infrastructure;

    ➁ The wafer, produced using TSMC's 2nm process, is part of Marvell's platform for developing custom XPU, switches, and other technologies to enhance cloud service providers' global operations;

    ➂ Marvell's platform strategy focuses on developing a comprehensive semiconductor IP product portfolio, including SerDes, chip-to-chip interconnects, advanced packaging technologies, and custom high-bandwidth memory (HBM) computing architectures;

    ➃ Marvell also introduced 3D synchronous bidirectional I/O with speeds up to 6.4 Gbits/second for connecting vertically stacked chips within a single die;

    ➄ The company expects custom silicon to account for about 25% of the accelerated computing market by 2028;

    ➅ Marvell's 2nm platform is tailored for TSMC's 2nm process technology and includes technologies for developing cloud-optimized accelerators, Ethernet switches, and digital signal processors;

    ➆ Marvell's custom HBM computing architecture allows XPU to achieve higher computing and memory density;

    ➇ The new architecture enhances XPU performance by serializing and accelerating the I/O interface between the AI computing accelerator silicon wafer and the HBM wafer;

    ➈ Marvell's custom AI accelerator architecture integrates XPU computing silicon wafers, HBM, and other chips with Marvell's 3D SiPho engine on the same substrate;

    ➉ Marvell has been a pioneer in changing interconnect technology, focusing on improving the performance, scalability, and cost-effectiveness of accelerated infrastructure.

  • Nanfu Battery Steps In to Rescue 15 Billion Yuan Chongqing Chip Unicorn

    融中财经

    ➀ Nanfu Battery has invested in the GPU unicorn 'Xiangdi Xian', which is valued at 15 billion yuan in Chongqing;

    ➁ 'Xiangdi Xian' has successfully completed a new round of strategic financing worth several hundred million yuan;

    ➂ Anfu Technology, an A-share listed company, has reached a deep strategic cooperation with 'Xiangdi Xian';

    ➃ Anfu Technology, through its acquisition of Nangfu Battery, has transformed from a traditional retail company to a high-tech consumer battery company.

  • Huizing Holding Halts Acquisition of Yunyinggu Technology (First OLED Chip)

    芯榜

    ➀ Huizing Holding announced the termination of its acquisition of Yunyinggu Technology due to disagreements on key commercial terms.

    ➁ The acquisition was intended to expand Huizing's business in the semiconductor sector.

    ➂ Yunyinggu Technology is backed by major investors including Xiaomi, Huawei, and BOE.

    ➃ Huizing's founder, Gu Jing, has a background in Tsinghua University and Harvard, focusing on high-resolution signal processing.

  • TSMC Invests 730 Billion Yuan in US Expansion, CEO Wei Zhejia Speaks, Trump Listens

    芯东西

    ➀ TSMC announced a $100 billion investment plan in the US, including the construction of 5 new chip factories over the next few years;

    ➁ The new investment includes 3 chip manufacturing plants and 2 advanced packaging factories, as well as a large-scale R&D center in the US;

    ➂ Trump emphasized the importance of chip and semiconductor manufacturing within the US for national security;

    ➃ TSMC promises to create 40,000 construction jobs in the US over the next four years;

    ➄ TSMC began producing 4nm chips for US customers in Arizona and has agreed to produce 2nm chips in its second Arizona factory, set to start production in 2028.

  • March 3

  • President's Focus on Wuhan's New Breakthroughs: Upgrades and Innovations!

    芯榜

    ➀ In 2013, President Xi Jinping visited Wuhan's Optics Valley Exhibition Center, where he viewed innovative achievements in fiber optic communication, 3D printing, and biomass energy.

    ➁ In 2018, he visited the FiberHome Technology Group and Changjiang Fiber Optics, where he learned about the development of air-core fiber technology.

    ➂ In 2022, at Wuhan Huagong Laser Engineering Co., Ltd., he inspected the application of laser technology in the semiconductor industry.

    ➃ In 2024, at the Wuhan Institute of Industrial Innovation and Development, he watched the demonstration of innovative technology supply chain platforms and achievements.

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