12/04/2024, 06:00 AM UTC
VSMC在新加坡庆祝300mm晶圆厂奠基仪式VSMC Celebrates Breaking Ground on 300mm Fab in Singapore
1. VSMC，由Vanguard International Semiconductor Corporation和NXP Semiconductors合资成立，在新加坡庆祝其新的300mm晶圆制造工厂的奠基仪式。2. 该工厂预计将于2027年开始生产，到2029年每月产量将达到55,000片300mm晶圆。3. 新工厂将支持NXP的增长计划，并为半导体产业的发展做出贡献。1. VSMC, a joint venture between Vanguard International Semiconductor Corporation and NXP Semiconductors, celebrated the groundbreaking of its new 300mm wafer manufacturing facility in Singapore. 2. The facility is expected to start production in 2027 and reach an output of 55,000 300mm wafers per month by 2029. 3. The new fab will support NXP's growth plans and contribute to the development of the semiconductor industry.---
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