06/20/2024, 02:03 PM UTC
范德华接触的晶圆级二维材料集成Wafer-Scale 2D Material Integration With Van Der Waals Contacts
1、中国科学技术大学的研究人员开发了一种全堆叠技术，用于二维材料与范德华接触的集成，避免了传统金属沉积造成的损伤。2、该技术显著提高了二维电子器件的电性能，将关态电流降低了95%，并提高了开断比。3、使用该方法制造的器件的高产量和一致性证明了其在大规模工业制造中的潜力。1. Researchers from USTC developed an all-stacking technique for integrating 2D materials with van der Waals (vdW) contacts, avoiding damage from traditional metal deposition. 2. This technique significantly improves the electrical performance of 2D electronic devices, reducing off-state current by 95% and enhancing on-off ratios. 3. The high yield and consistency of devices made using this method demonstrate its potential for large-scale industrial manufacturing.
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