04/15/2025, 05:21 AM UTC
超薄热管改变智能手机散热Ultra-Thin Heat Pipe Transforms Smartphone Cooling
➀ 名古屋大学的研究人员开发了一种超薄环形热管（UTLHP），可提升智能手机和平板电脑的散热性能，使设备更轻薄且性能更强。
➁ 这一创新的冷却系统采用烧结铜网结构，促进了毛细作用，其导热性能比铜高45倍，比石墨片高10倍。
➂ UTLHP厚度仅为0.3毫米，适合现代轻薄设备，同时能稳定传输高达10瓦的热量。
➀ Researchers at Nagoya University have developed an ultra-thin loop heat pipe (UTLHP) that improves smartphone and tablet cooling, allowing for slimmer and more powerful devices without sacrificing performance.
➁ This innovative cooling system uses a sintered copper wick structure that facilitates capillary action, offering a heat transfer performance 45 times higher than copper and 10 times better than graphite sheets.
➂ The UTLHP is only 0.3 mm thick, making it suitable for modern slim devices while maintaining stable heat transport of up to 10 watts.
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