<p>➀ Researchers at Nagoya University have developed an ultra-thin loop heat pipe (UTLHP) that improves smartphone and tablet cooling, allowing for slimmer and more powerful devices without sacrificing performance.</p><p>➁ This innovative cooling system uses a sintered copper wick structure that facilitates capillary action, offering a heat transfer performance 45 times higher than copper and 10 times better than graphite sheets.</p><p>➂ The UTLHP is only 0.3 mm thick, making it suitable for modern slim devices while maintaining stable heat transport of up to 10 watts.</p>