04/29/2025, 06:06 AM UTC
新型芯片检测堆叠电子器件的冷却效果New Chip Checks Cooling For Stacked Electronics
➀ 麻省理工学院林肯实验室开发了一种专用芯片，用于测试3D堆叠微电子器件的冷却方案，解决高功率密度系统中的过热难题；
➁ 该芯片模拟真实芯片发热（高达千瓦/平方厘米），通过内置微型温度传感器监测冷却过程中的温度变化，精确评估散热效率；
➂ 可复现3D堆叠结构中分布式热量与局部热点，帮助研究人员优化深层芯片的散热方案并验证微通道液冷等技术的实际效果。
➀ MIT Lincoln Laboratory developed a specialized chip to test cooling solutions for 3D-stacked microelectronics, addressing overheating challenges in high-power density systems.
➁ The chip generates heat (up to kilowatts/cm²) to mimic real chip behavior and measures temperature changes through embedded "tiny thermometers," enabling precise cooling efficiency evaluation.
➂ It replicates both distributed heat and localized hot spots in 3D stacks, helping researchers optimize thermal management for buried layers and validate methods like liquid microchannel cooling.
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
