06/26/2025, 05:22 AM UTC
第75届ECTC会议聚焦三大封装技术主题75th ECTC packaging themes
➀ 第75届ECTC会议聚焦三大封装技术主题：共封装光学（CPO）集成、混合键合（HB）进展以及背面供电（BPD）热管理；
➁ CPO部分探讨了玻璃基板等先进材料在解决AI小芯片热/光学问题中的应用，而HB议题着重于提升密度、减少缺陷及存储器/3D IC的计量技术；
➂ BPD散热方案研究了3D架构中的层间冷却、多层级建模及微通道等创新结构，以应对功率密度带来的热挑战。
➀ The 75th ECTC highlighted three key packaging themes: Co-Packaged Optics (CPO) integration, Hybrid Bonding (HB) advancements, and thermal management for Backside Power Delivery (BPD).;
➁ CPO discussions emphasized materials innovation (e.g., glass substrates) to address thermal and optical challenges in AI chiplets, while HB sessions focused on scaling density, reducing defects, and integrating metrology for memory/3D IC applications;
➂ BPD thermal solutions explored interlayer cooling, multi-level modeling, and novel structures like microchannels to tackle heat dissipation in 3D architectures.
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