<p>➀ AMD announced the Instinct MI350 series, currently shipping to customers, featuring HBM3E memory and OAM packaging;</p><p>➁ The MI350 utilizes eight HBM3E stacks and two I/O dies, compatible with the OCP UBB platform for scalable 8-GPU configurations;</p><p>➂ Both air-cooled (MI350X) and liquid-cooled (MI355X) variants are available, promising higher performance and memory density compared to the previous MI300X generation.</p>
Related Articles
- Prototype of a Particularly Sustainable and Energy-Autonomous E-Bike Terminal Developed at HKA7 months ago
- Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications7 months ago
- White Knight to save Shibaura7 months ago
- Ed Rides The Tariff Roller-Coaster7 months ago
- Image Acquisition Software Launch for Centralized Control of NanoZoomer® MD Series7 months ago
- Trump creates U.S. Investment Accelerator to manage CHIPS Act and 'negotiate much better deals'7 months ago
- Contactless Timing for Paralympic Swimming7 months ago
- Fishing7 months ago
- Ed Tackles PIP7 months ago
- Reprogramming Liver Immunity: A Lipid Nanoparticle Approach for Pancreatic Cancer Therapy8 months ago