<p>➀ Marvell showcased advanced memory technologies at Hot Chips 2025, including dense 2nm SRAM with 17x higher bandwidth density than standard IP, leveraging TSMC's 2nm process and optimized Vmins for lower power consumption;</p><p>➁ The company introduced custom HBM solutions using die-to-die interfaces to reduce on-chip area and power, collaborating with major HBM suppliers to enhance AI accelerator compatibility;</p><p>➂ Marvell also demonstrated high-capacity DDR memory expanders with integrated Arm Neoverse v2 CPUs and hardware security, improving latency and bandwidth for large-scale AI workloads.</p>