02/13/2025, 06:06 AM UTC
英飞凌扩展CoolSiC MOSFET产品线，新增Q-DPAK和TOLL封装Infineon adds to CoolSiC MOSFETs
➀ 英飞凌扩展其离散CoolSiC MOSFET产品线，推出两个新的Q-DPAK和TOLL封装系列。
➁ 这些系列针对高、中功率SMPS应用，如人工智能服务器、电动汽车充电器和类人机器人。
➂ TOLL封装具备TCoB功能，可实现紧凑的系统设计，而Q-DPAK封装则补充了英飞凌的顶侧冷却（TSC）产品系列。
➀ Infineon expands its discrete CoolSiC MOSFETs portfolio with two new families in Q-DPAK and TOLL packages.
➁ These families are designed for high- and medium-power SMPS applications such as AI servers, electric vehicle chargers, and humanoid robots.
➂ The TOLL package features TCoB capability for compact system designs, while the Q-DPAK package complements Infineon's Topside Cooled (TSC) products.
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