04/14/2025, 08:10 AM UTC
博世扩展与Arrow Electronics在EMEA地区汽车零部件的协议Bosch extends Arrow agreement for automotive components in EMEA
➀ 博世已与Arrow Electronics签署协议，扩展其在EMEA地区的汽车半导体组件分销；
➁ 该协议包括博世的MEMS传感器、ASIC和SiC芯片；
➂ 博世提供了两代SiC芯片，其中最新的芯片在整个温度范围内具有非常低的导通电阻。
➀ Bosch has signed an extension with Arrow Electronics to distribute its automotive semiconductor components in EMEA;
➁ The agreement includes Bosch’s MEMS sensors, ASICs, and SiC chips;
➂ Two generations of Bosch SiC chips are available, with the latest offering very low on-resistance across the temperature range.
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本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
