11/26/2024, 10:55 AM UTC
士兰微晶圆、封装两大项目延期两年Solanus Microelectronics Delays Two Major Projects by Two Years
<p>➀ 杭州士兰微电子决定将“年产36万片12英寸芯片”及“汽车半导体封装（一期）”两个募集资金投资项目原定预定可使用状态日期延期至2026年12月。</p><p>➁ 延期原因是项目规模大、资金需求高及市场竞争等因素导致进度放缓。</p><p>➂ 公司通过向特定对象发行股票，共计募集资金净额约49.13亿元，设立专项账户存储。</p><p>➀ Solanus Microelectronics has decided to extend the scheduled operational status dates of its 'Annual Production of 360,000 12-inch Wafer Chips' and 'Automotive Semiconductor Packaging (Phase I)' projects to December 2026.</p><p>➁ The decision to delay is due to the large scale of the projects, high capital requirements, and market competition.</p><p>➂ The company has raised approximately 4.913 billion yuan through the issuance of shares to specific objects, which will be stored in a special account.</p>
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