03/14/2025, 06:34 PM UTC
韩华半导体将为SK海力士供应14台14TC粘合机用于HBM生产Hanwha Semitech to supply 14 TC bonders to SK Hynix for HBM
韩华半导体周五宣布，已与SK海力士签订了一份价值210亿韩元的协议，将向其供应高带宽内存（HBM）生产设备。此前称为韩华精密机械的公司未具体说明设备，但几乎可以确定是热压缩（TC）粘合机。
Hanwha Semitech announced on Friday that it has entered into a 21 billion won agreement to supply high-bandwidth memory (HBM) production equipment to SK Hynix. The company, previously known as Hanwha Precision Machinery, did not specify the equipment, but it is almost certain to be thermal compression (TC) bonders.
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