10/21/2024, 08:42 AM UTC
光芯片的高速封装工艺及可靠性High-Speed Packaging Technology and Reliability of Optical Chips
<p>➀ 我们光模块里用的光学芯片，都是各种晶体材料制作的，十分的娇嫩，从封装工艺来看，不同的芯片种类工艺有所差异。</p><p>➁ 持续的AI算力推动产业向高速光模块快速迭代，且一再推高市场预期。</p><p>➂ 高速光模块的特点包括速率高、带宽大、功耗大，芯片内部温度升高导致对可靠性的关注度增加。</p><p>➃ 有些工艺既影响带宽，也影响可靠性。</p><p>➄ 封装技术是整个产业链中非常重要的环节。</p><p>➀ Optical chips used in optical modules are made of various crystal materials and are very delicate.</p><p>➁ The packaging technology for different types of chips varies.</p><p>➂ The continuous advancement of AI's computing power drives the industry towards high-speed optical modules and raises market expectations.</p><p>➃ High-speed optical modules have characteristics such as high speed, large bandwidth, high power consumption, and increased attention to reliability due to internal temperature rise.</p><p>➄ Some processes affect both bandwidth and reliability.</p><p>➅ Packaging technology is a crucial part of the entire industry chain.</p>
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