10/29/2024, 09:31 AM UTC
混合键合：在先进封装领域的进展与挑战Hybrid Bonding: Progress and Challenges in Advanced Packaging
<p>➀ 混合键合在先进封装领域越来越受到关注，因为它提供了功能相似或不同芯片之间最短的垂直连接，以及更好的热学、电气和可靠性结果。</p><p>➁ 尽管一些芯片制造商确实在大批量制造 (HVM) 中采用了混合键合，但目前该工艺的成本太高，无法大规模采用。其他挑战包括需要更好的铜凹陷均匀性、更快的芯片到晶圆放置和更佳的对准、多个键合和解键合载体（这会增加成本）以及低温退火能力。</p><p>➂ AI 芯片和模块是混合键合和先进封装的巨大推动力。它们的高性能和高价格有助于推动行业发展。</p><p>➀ Hybrid bonding is gaining attention in advanced packaging for its ability to provide the shortest vertical connections between chips with similar or different functions, as well as better thermal, electrical, and reliability results.</p><p>➁ Despite some chip manufacturers adopting hybrid bonding in large-scale manufacturing, the high cost of the process makes it unsuitable for mass adoption. Challenges include better copper dimple uniformity, faster wafer-to-chip placement, and better alignment, multiple bonding and debonding carriers (which increase costs), and low-temperature annealing capabilities.</p><p>➂ The development of AI chips and modules is a significant driver for hybrid bonding and advanced packaging. High-performance and high prices of these chips help to drive industry development.</p>
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