10/18/2024, 01:13 PM UTC
先进封装，关注什么？Advanced Packaging: What to Focus On?
<p>➀ 半导体封装从1D PCB设计发展到晶圆级的3D混合键合技术；</p><p>➁ 2.5D和3D封装的核心技术，包括各种中介层材料，如Si中介层、有机中介层、玻璃中介层和Cu-Cu混合键合；</p><p>➂ 每种技术的优缺点，如Si中介层的高成本和面积限制，有机中介层的成本效益和RC延迟，玻璃中介层的优势和技术挑战；</p><p>➃ 关键市场趋势，如更大的中介层面积、面板级封装和玻璃中介层的采用；</p><p>➄ HBM混合键合和CPO在提高I/O带宽和降低能耗方面的重要性；</p><p>➅ 先进封装在HPC、5G/6G和消费电子市场的意义。</p><p>➀ The evolution of semiconductor packaging from 1D PCB design to wafer-level 3D hybrid bonding;</p><p>➁ The core technologies of 2.5D and 3D packaging, including various interlayer materials;</p><p>➂ The advantages and challenges of each technology, such as Si interlayer, organic interlayer, glass interlayer, and Cu-Cu hybrid bonding;</p><p>➃ Key market trends like larger interlayer area, panel-level packaging, and glass interlayer adoption;</p><p>➄ The importance of HBM hybrid bonding and CPO in enhancing I/O bandwidth and reducing energy consumption;</p><p>➅ The significance of advanced packaging in HPC, 5G/6G, and consumer electronics markets.</p>
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本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
