10/13/2024, 08:27 PM UTC
国产车规晶圆代工领跑者，芯联集成如何应对新的挑战和机遇？Domestic Leader in Automotive Wafer Fabrication: How Unigroup Corelink Integrates Navigates Challenges and Opportunities?
<p>➀ 芯联集成凭借在IGBT、SiC MOSFET、BCD工艺、MEMS晶圆代工及功率模块封装领域的领先技术，在多个细分市场取得领先优势。</p><p>➁ 芯联集成成立于2018年，最初从事MEMS和功率器件的晶圆代工及封装测试业务，逐步扩展到碳化硅、氮化镓等宽禁带半导体的工艺研发。</p><p>➂ 芯联集成的产品线覆盖功率半导体、传感信号链、数模混合高压模拟IC等领域，广泛应用于新能源汽车、工业控制、高端消费品市场。</p><p>➀ Unigroup Corelink has achieved a leading position in the automotive wafer fabrication market through its advanced technologies in IGBT, SiC MOSFET, BCD process, MEMS wafer fabrication, and power module packaging.</p><p>➁ Corelink was founded in 2018 and has expanded from MEMS and power device wafer fabrication and packaging to wide-bandgap semiconductor process development.</p><p>➂ Corelink's product line covers power semiconductors, sensor signal chains, analog mixed-signal high-voltage ICs, and is widely used in new energy vehicles, industrial control, and high-end consumer markets.</p>
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
