SemiVoice

semiwiki

06/26/2024, 05:00 PM UTC

新型3D热分析EDA工具New EDA Tool for 3D Thermal Analysis

1、西门子EDA推出Calibre 3DThermal，一款用于芯片和3D集成电路设计早期热分析的新工具。2、该工具实现了高效的左移分析和验证，使团队能够在设计过程早期开始热分析。3、Calibre 3DThermal与现有的西门子EDA工具集成，并支持多物理场分析，有助于满足热、功率和时序目标。

1. Siemens EDA introduces Calibre 3DThermal, a new tool for early thermal analysis in chiplet and 3D IC designs. 2. The tool enables efficient shift-left analysis and verification, allowing teams to start thermal analysis early in the design process. 3. Calibre 3DThermal integrates with existing Siemens EDA tools and supports multi-physics analysis, aiding in meeting thermal, power, and timing goals.

---

本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。