04/21/2025, 04:18 PM UTC
汉米半导体向美光供应的TC封连良率高于日本新川Hanmi Semiconductor’s TC bonders to Micron ahead in yield rate to Shinkawa’s
据TheElec报道，汉米半导体供应给美光用于生产高带宽内存（HBM）的热压缩（TC）封连设备，其良率高于日本竞争对手新川的产品。汉米半导体最近召回客户反馈，以确认其封连设备的优越性能。
Hanmi Semiconductor’s thermal compression (TC) bonders supplied to Micron for the production of high-bandwidth memory (HBM) have achieved higher yield rates than those supplied by Shinkawa, a Japanese rival, according to TheElec. Hanmi Semiconductor recently recalled its customers’ feedback to confirm the superior performance of its bonders.
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