04/07/2025, 07:33 AM UTC
韩国晶圆厂设备制造商因HBM和先进封装技术利润激增Korean fab equipment makers see profit jump from HBM, advanced packaging
去年，韩国晶圆厂因高带宽内存（HBM）和先进封装技术而普遍实现了利润增长。《TheElec》根据该国46家主要晶圆厂设备制造商向金融监管机构的财务报告进行了分析。
被审查的公司之一，韩美半导体，实现了显著的利润增长。
South Korean fabs saw a profit increase last year, primarily due to high-bandwidth memory (HBM) and advanced packaging technologies. TheElec analyzed the financial filings of 46 major fab equipment manufacturers in the country.
Hanmi Semiconductor, one of the companies reviewed, experienced a notable rise in profits.
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