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thelec

05/14/2025, 08:14 AM UTC

华为运营至少11家半导体晶圆厂，聚焦DRAM与代工业务Huawei operating at last 11 semiconductor fabs on DRAM and foundry

➀ 华为目前运营至少11家半导体晶圆厂，包含研发设施总数可达20家；

➁ 产线覆盖存储芯片（含DRAM）及物联网/移动设备逻辑芯片制造；

➂ 产能扩张响应中国半导体自主战略，突破美国技术封锁

➀ Huawei operates at least 11 semiconductor fabs, expanding to 20 including R&D facilities;

➁ Facilities produce memory chips (including DRAM) and logic chips for IoT/mobile devices;

➂ Expansion supports China's semiconductor self-reliance strategy amid US export restrictions

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