08/23/2024, 07:23 AM UTC
Meta 200G FR4与400G FR4失效统计Failure Analysis of Meta's 200G FR4 and 400G FR4 Optical Modules
➀ 200G FR4模块中，50G PAM4 DFB激光器失效占比52.7%，主要表现为功率下降或无功率。➁ PCBA失效占比大幅增加至24.8%，可能与高速HDI板和高密度焊接工艺有关。➂ Rx端金丝键合工艺导致15.9%的失效。➃ 400G FR4模块采用EML而非DFB，失效率降至13.4%，PCBA成为主要失效点。➀ 52.7% of failures in 200G FR4 modules are due to 50G PAM4 DFB laser power degradation or absence. ➁ PCBA failures significantly increased to 24.8%, likely due to high-speed HDI board and dense soldering processes. ➂ 15.9% of failures are attributed to gold wire bonding in the Rx section. ➃ In 400G FR4 modules, EML is used instead of DFB, resulting in lower failure rates at 13.4%, with PCBA emerging as the primary failure point.
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
