12/09/2024, 06:33 AM UTC
深度解读：拜登绝唱版芯片制裁方案的重点In-Depth Analysis: The Key Points of Biden's Final Chip Sanctions Plan
➀ 美国商务部已对设备、软件以及HBM实施新的管制，将140家中国半导体企业列入“实体名单”。
➁ 此次制裁是历次制裁的集大成者，用美国商务部长雷门多的话说，“集创新与全面于一体”。
➂ 制裁细则包括限制美国、日本、欧洲之外区域的关键设备、芯片或技术的转移，以及将半导体相关软件及“软件秘钥”列入限制。
➀ The U.S. Department of Commerce has imposed new restrictions on equipment, software, and HBM, listing 140 Chinese semiconductor companies on the 'Entity List'.
➁ The sanctions are a culmination of previous measures, with the U.S. Commerce Secretary describing it as 'comprehensive and innovative'.
➂ The details of the sanctions include restrictions on the transfer of key equipment, chips, or technology outside of the U.S., Japan, and Europe, and the inclusion of semiconductor-related software and 'software keys' in the restrictions.
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本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
