09/09/2024, 08:32 AM UTC
三星：业界最薄封装LPDDR5X，仅厚0.65毫米！Samsung Unveils Industry's Thinnest LPDDR5X Packaging: Just 0.65 Millimeters Thick!
➀ 三星宣布开始量产业界最薄的12GB和16GB LPDDR5X模块，厚度约为0.65毫米；➁ 新封装比标准LPDDR5X封装薄0.06毫米，热阻提高21.2%；➂ 更薄的LPDDR5X封装有助于提升智能手机内部气流，改善热管理，从而提升性能和电池寿命。➀ Samsung has announced the mass production of the thinnest LPDDR5X modules in the industry, with a thickness of approximately 0.65 millimeters; ➁ The new packaging is 0.06 millimeters thinner than the standard LPDDR5X, improving thermal resistance by 21.2%; ➂ The thinner LPDDR5X封装 enhances internal airflow in smartphones, improving thermal management and battery life.
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
