➀ AMD's Instinct MI300 series packaging adopts advanced 3.5D technology, integrating traditional chip design with organic packaging, passive silicon interposers, IOD, XCD, CCD layouts, and HBM3 chips. ➁ The design is based on a Chiplet architecture, featuring multiple small chips connected through high-speed communication channels, achieving communication rates up to 3 TB/s and 2.4 TB/s. ➂ The packaging complexity poses challenges, especially in managing data lines, power, and ground connections, requiring precise design and layout to ensure stable power supply to each Chiplet.