06/12/2025, 06:08 AM UTC
面向边缘AI的系统模块System On Module For Edge AI
➀ SiMa.ai与Enclustra合作推出基于50 TOPS MLSoC Modalix芯片的边缘AI系统模块；
➁ 该方案降低开发成本，支持生成式AI与多模态AI，可应用于机器人、无人机等领域，兼容Python/PyTorch开发框架；
➂ 具备多接口、紧凑设计、工业级温控等特性，实时性能监控功能优化边缘计算效率。
➀ SiMa.ai and Enclustra co-developed a System-on-Module (SoM) using MLSoC Modalix 50 TOPS chip for edge AI applications;
➁ The solution reduces development costs and time, supports Gen AI and multi-modal AI in robotics/drones with Python/PyTorch compatibility;
➂ Features 50 TOPS performance, multiple I/O options, compact form factor, and industrial-grade thermal management.
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