➀ Nee Guohua emphasized that the integration of RISC-V and Chiplet will promote the innovation of DSA (Domain Specific Architecture) and lead to the 'Hardware Defined by Demand' era; ➁ The level of China's chip design has reached the world's advanced level in digital chips, but there is still a gap in analog chips; ➂ Scientists must not only have solid professional knowledge but also be brave in innovation and willing to take responsibility; ➃ RISC-V, as an emerging open instruction set architecture, is gaining global attention and is expected to promote innovation with its openness, efficiency, flexibility, low power consumption, modularity, and scalability; ➄ Chiplet technology, which encapsulates multiple pre-designed small chips into a complete SoC, is introduced to lower design complexity and cost while improving performance and flexibility; ➅ DSA (Domain Specific Architecture) computing architecture, characterized by customized design to better meet specific needs, shows great potential in emerging fields such as AI and IoT; ➆ The integration of RISC-V, extended instruction sets, Chiplet, and interconnect technologies in DSA new servers is expected to replace traditional X86 servers in terms of cost-performance and energy consumption, thus promoting the transformation and development of the Chinese server market; ➇ In the new era of 'Hardware Defined by Demand', hardware design will no longer rely solely on traditional standardized and generalized approaches but will be more closely integrated with actual application needs.
Related Articles
- Harnessing Modular Vector Processing for Scalable, Power-Efficient AI Acceleration8 months ago
- RISC-V set to announce 25% market penetration — open-standard ISA is ahead of schedule, securing fast-growing silicon footprint5 days ago
- Nice detailed review of AMD’s chiplet technology12 days ago
- China's 96-core x86 CPU taps chiplet design to rival AMD EPYC and Intel Xeon — 13 chiplets per processor provide up to 384 cores on a single motherboard, but no word on power consumption13 days ago
- Alphawave Semi tapes out on TSMC 3nm18 days ago
- Solderless connections for leading-edge ICs27 days ago
- New Quantum Architecture Supports Lego Like Modular Designabout 1 month ago
- SiFive 2nd Gen Intelligence Family Launchedabout 1 month ago
- TSMC increases Arizona internships to feed its Phoenix fabs — CHIPS-fueled supply chain begins to take shapeabout 1 month ago
- 64Gbit/s die-to-die interconnectabout 2 months ago