05/26/2025, 06:53 AM UTC
高效物联网设备芯片Chips For Efficient IoT Devices
➀ 芯科科技推出基于22纳米工艺的Series 3系列新品SiXG301和SiXG302 SoC，提升物联网设备的效能与性能；
➁ SiXG301针对有线供电场景，支持Matter、蓝牙、Zigbee和Thread协议，SiXG302则专注于电池设备的超低功耗设计；
➂ 方案集成安全特性，可扩展应用于智能家居、智慧城市、医疗及工业系统等领域。
➀ Silicon Labs introduces SiXG301 and SiXG302 SoC families under its Series 3 portfolio, built on a 22nm process for enhanced IoT device efficiency and performance;
➁ SiXG301 targets line-powered applications with support for Matter, Bluetooth, Zigbee, and Thread, while SiXG302 focuses on ultra-low power consumption for battery-operated devices;
➂ The solutions address diverse use cases including smart homes, cities, healthcare, and industrial systems with integrated security and scalability.
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