08/19/2024, 07:52 PM UTC
像素全画幅CIS芯片中国造，思特微进军单反相机市场Industry's First 180 Million Pixel Full-Frame CIS Chip Made in China, ST Micro Enters SLR Camera Market
➀ 晶合集成与思特威-W联合开发了业界首颗1.8亿像素全画幅CIS芯片，采用光刻拼接技术。 ➁ 该芯片具备1.8亿超高像素，支持8K 30 fps及HDR模式。 ➂ 这一突破挑战了日本索尼在超高像素全画幅CIS领域的长期垄断地位。 ➃ 此次成功标志着中国半导体技术在全球市场的重要进步。➀ Jinghe Integration and SmartSens-W jointly developed the industry's first 180 million pixel full-frame CIS chip using lithography splicing technology. ➁ The new chip features 1.8 billion ultra-high pixels and supports 8K 30 fps with HDR capabilities. ➂ This breakthrough challenges the long-standing dominance of Japanese Sony in the high-pixel full-frame CIS market. ➃ The success of this chip marks a significant advancement for Chinese semiconductor technology in the global market.
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