09/03/2024, 06:58 PM UTC
HotChip2024-Day1合集：AI芯片HotChip2024-Day1: AI Chip Highlights
➀ AMD MI300X采用Infinity Fabric Advanced Package实现高速互连，支持FP8运算。 ➁ Intel Gaudi 3引入256x256矩阵乘法引擎，增强互连性。 ➂ SambaNova SN40L提供大容量片上内存和混合Mesh/Ring互连结构。 ➃ FuriosaAI推出基于爱因斯坦求和符号的张量收缩处理器。 ➄ Tenstorrent的架构强调异步内存访问和可扩展的2D/3D Torus网络。 ➅ BRCM专注于CPO技术，实现高密度光互连。 ➆ IBM Telum 2在其下一代大型机处理器中集成了DPU和AI加速器。➀ AMD MI300X features Infinity Fabric Advanced Package for high-speed interconnects and supports FP8 operations. ➁ Intel Gaudi 3 introduces a 256x256 matrix multiplication engine and enhanced interconnectivity. ➂ SambaNova SN40L offers large on-chip memory and a hybrid Mesh/Ring interconnect structure. ➃ FuriosaAI introduces a Tensor Contraction Processor based on Einstein summation notation. ➄ Tenstorrent's architecture emphasizes asynchronous memory access and a scalable 2D/3D Torus network. ➅ BRCM focuses on CPO technology for high-density optical interconnects. ➆ IBM Telum 2 integrates a DPU and AI accelerator in its next-gen mainframe processor.
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