06/24/2025, 10:20 AM UTC
面向微发光二极管晶圆的软测试方法Soft Test Method For Micro-LED Wafers
➀ 天津大学团队开发了一种无损微LED晶圆“软接触”测试技术，采用柔性三维探针阵列，施加仅0.9 MPa的极低接触压力避免晶圆损伤；
➁ 该探针压力仅为传统刚性探针的万分之一，在保护晶圆表面的同时实现超100万次循环使用寿命；
➂ 该项技术填补了微LED电致发光检测领域空白，已进入产业化阶段，为提升显示器件良率提供创新解决方案，并具备拓展至柔性电子检测的潜力。
➀ Researchers at Tianjin University developed a non-destructive 'soft-touch' testing method for micro-LED wafers using flexible 3D probes with minimal pressure (0.9 MPa) to prevent surface damage;
➁ The system achieves 1/10,000th the pressure of traditional probes, ensuring wafer integrity and extending probe lifespan to over 1 million cycles;
➂ This innovation addresses critical quality control challenges in micro-LED production, enabling efficient yield screening and showing potential for commercialization in flexible electronics.
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