10/16/2024, 05:23 PM UTC
玻璃基板Chiplet先进封装及多物理场仿真Glass Substrate Chiplet Advanced Packaging and Multi-Physical Field Simulation
<p>➀ 芯片技术将原本集成于单个系统级芯片（SoC）中的各个元件拆分，独立为多个具有特定功能的小芯片（芯粒），然后通过先进封装技术将不同芯粒彼此互联，最终集成封装为一个系统级芯片组。先进封装技术可以从互连密度、传输信号优化、散热性能改善、降低先进制成依赖、异质集成等不同维度提升芯粒芯片设计和性能，加速芯片设计与应用落地。</p><p>➁ 随着芯片性能的不断提升，芯粒设计对基板的信号传输速度提出了更高的要求。传统基板在信号传输速度上逐渐难以满足需求，而玻璃基板凭借更快的信号传输速率、更低的介电损耗、更高的互联密度正好可以弥补这一不足，为芯粒芯片提供更快的信号传输通道。此外，玻璃基板具有较大的封装尺寸和良好的机械稳定性，相同面积下可容纳更多的芯粒，为芯粒的大规模集成提供了有利条件，能够实现更复杂的系统级封装，进而满足高性能计算、人工智能等领域对芯片性能的需求。</p><p>➂ 10月18日19:30，「智猩猩芯粒与先进封装公开课」第11期将开讲，由湖南越摩研究院院长马晓波主讲，主题为《玻璃基板芯粒先进封装及多物理场仿真》。马晓波将介绍芯粒先进封装技术的前景及行业发展现状，并分享玻璃基板在先进封装中的应用优势。之后，他将着重讲解面向玻璃基板芯粒先进封装的多物理场仿真，以及深度学习在先进封装仿真中的应用及未来发展趋势。</p><p>➀ Chiplet technology breaks down components from a single system-on-chip (SoC) into multiple small chips (chiplets) with specific functions, and then interconnects them using advanced packaging technology to form a system-in-package (SiP). Advanced packaging technology enhances Chiplet design and performance in terms of interconnect density, signal transmission optimization, thermal performance improvement, reduction of process dependency, and heterogeneous integration, accelerating chip design and application deployment.</p><p>➁ With the continuous improvement of chip performance, Chiplet design requires higher signal transmission speed from the substrate. Traditional substrates struggle to meet this demand, but glass substrates offer faster signal transmission rates, lower dielectric losses, and higher interconnect density, providing faster signal transmission channels for Chiplet chips. Additionally, glass substrates have larger packaging sizes and good mechanical stability, allowing for more chiplets in the same area, facilitating large-scale integration of Chiplets and enabling more complex system-in-package designs to meet the performance requirements of high-performance computing and artificial intelligence.</p><p>➂ On October 18th at 19:30, the 11th 'Xing Xing Chiplet and Advanced Packaging Public Lecture' will feature a talk by Ma Xiaobo, President of Hunan YueMo Research Institute, titled 'Glass Substrate Chiplet Advanced Packaging and Multi-Physical Field Simulation'. Ma will discuss the prospects and industry status of Chiplet advanced packaging technology, share the application advantages of glass substrates in advanced packaging, and focus on multi-physical field simulation for glass substrate Chiplet advanced packaging and the application and future development trends of deep learning in advanced packaging simulation.</p>
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