➀ Huahai Qingke has launched a new generation of 12-inch ultra-precision wafer thinning machine, Versatile-GP300, which represents a significant breakthrough in wafer thinning technology and enhances the company's competitiveness in the semiconductor equipment market. ➁ The first Versatile-GP300 machine has successfully completed verification, demonstrating excellent performance and stability, and gaining high recognition from customers. ➂ The machine integrates ultra-precision grinding, polishing, and cleaning units, ensuring high precision and quality in wafer thinning processes. It also provides various system expansion options to meet diverse customer needs.