09/27/2024, 01:13 PM UTC
华海清科：12英寸设备完成首台验证Huahai Qingke Achieves First Verification of 12-Inch Equipment
➀ 华海清科成功推出新一代12英寸超精密晶圆减薄机Versatile-GP300，标志着在晶圆减薄技术上取得重大突破，并提升了公司在半导体设备市场的竞争力。➁ 首台Versatile-GP300机台顺利完成验证，表现出色，得到客户高度认可。➂ 该机台集成了超精密磨削、抛光及清洗单元，确保了晶圆减薄工艺的高精度与高质量，并提供多种系统功能扩展选项。➀ Huahai Qingke has launched a new generation of 12-inch ultra-precision wafer thinning machine, Versatile-GP300, which represents a significant breakthrough in wafer thinning technology and enhances the company's competitiveness in the semiconductor equipment market. ➁ The first Versatile-GP300 machine has successfully completed verification, demonstrating excellent performance and stability, and gaining high recognition from customers. ➂ The machine integrates ultra-precision grinding, polishing, and cleaning units, ensuring high precision and quality in wafer thinning processes. It also provides various system expansion options to meet diverse customer needs.
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
