08/23/2024, 07:25 AM UTC
硅“片上风扇”，为移动设备提供主动散热功能Silicon 'Fan-on-a-Chip' for Active Cooling in Mobile Devices
➀ xMEMS Labs 发布了 XMC-2400 µCooling 芯片，这是首款面向超移动设备和下一代 AI 解决方案的全硅 MEMS 主动式微型冷却风扇。➁ XMC-2400 是一款厚度仅为 1 mm 的静音、无振动、固态冷却解决方案，可集成到智能手机和平板电脑中。➂ 该芯片比非硅基主动冷却器小 96%，重量轻 96%，在 1000 Pa 背压下每秒可移动高达 39 立方厘米的空气。➀ xMEMS Labs introduces the XMC-2400 µCooling chip, the first silicon MEMS active cooling fan for ultramobile devices and AI solutions. ➁ The XMC-2400 is a 1 mm thick, silent, vibration-free, solid-state cooling solution that can be integrated into smartphones and tablets. ➂ The chip is 96% smaller and lighter than non-silicon active coolers, with a capability to move 39 cubic centimeters of air per second under 1000 Pa back pressure.
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