08/30/2024, 12:08 PM UTC
HBM4争夺战：高性能内存的新前沿The Battle for HBM4: A New Frontier in High-Performance Memory
➀ HBM4将双倍于HBM3E的通道宽度，显著提升数据传输速度和性能。➁ SK海力士和三星正激烈竞争成为首个量产HBM4的厂商，双方都计划为英伟达的AI芯片供货。➂ 将内存和逻辑半导体集成到单一封装中仍然是HBM4开发的主要挑战。➀ HBM4 is set to double the channel width of HBM3E, significantly enhancing data transfer speeds and performance. ➁ SK Hynix and Samsung are in a fierce race to be the first to mass-produce HBM4, with both aiming to supply Nvidia's AI chips. ➂ The integration of memory and logic semiconductors in a single package remains a significant challenge for HBM4 development.
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