09/04/2024, 07:22 AM UTC
C1轮融资加速MEMS扬声器与主动散热芯片发展Accelerating MEMS Speaker and Active Cooling Chip Development with Series C1 Funding
➀ 鋆昊资本领投xMEMS Labs的C1轮融资，助力其创新MEMS扬声器和超薄主动散热芯片的商业化。➁ xMEMS于2024年8月推出1毫米厚的主动散热产品，适用于高性能智能手机和AI芯片。➂ 公司于2023年底发布的Cypress扬声器大幅提升了低频声压级，是MEMS扬声器技术的一大突破。➀ Cloudview Capital leads C1 round investment in xMEMS Labs to support the commercialization of their innovative MEMS speakers and ultra-thin active cooling chips. ➁ xMEMS introduces a 1mm-thick active cooling product in August 2024, designed for high-performance smartphones and AI chips. ➂ The company's Cypress speaker, launched in late 2023, significantly enhances low-frequency sound pressure levels, marking a breakthrough in MEMS speaker technology.
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