06/12/2025, 07:11 AM UTC
HBM5竞争力将由浸没式冷却技术决定‘HBM5 competence to be determined by immersion cooling’
➀ 预计到2029年HBM5商业化时，冷却技术将成为HBM市场竞争的主要决定因素；
➁ 当前半导体市场主导权由先进封装技术决定，但未来将转向冷却方案；
➂ 浸没式冷却技术有望成为推动HBM5性能提升和市场应用的关键驱动力。
➀ Cooling technology is predicted to become the main competitive factor in the HBM market by 2029, coinciding with HBM5 commercialization;
➁ Current semiconductor market dominance is driven by packaging innovations, but focus will shift to cooling solutions in the future;
➂ Immersion cooling is expected to play a critical role in advancing HBM5 performance and market adoption.
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